American Made Advocacy: Smart Policies Can Ensure AI Data Centers Are Secure
Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
AIM Solder Joins International Electronics Manufacturing Initiative (iNEMI)
May 29, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials, is proud to announce its membership with the International Electronics Manufacturing Initiative (iNEMI). This strategic alliance underscores AIM Solder’s commitment to advancing the electronics manufacturing industry through collaboration and innovation.
iNEMI, a not-for-profit consortium, brings together the world’s leading electronics manufacturers, suppliers, associations, government agencies, and universities. Its mission is to forecast and accelerate improvements in the electronics manufacturing industry, addressing technology and infrastructure gaps through high-impact projects and proactive forums. iNEMI implements a global agenda, focusing on eliminating technology and infrastructure gaps through collaborative projects and industry forums.
“Joining iNEMI aligns perfectly with our mission to offer innovative and reliable product solutions to the electronics industry,” said Tim O’Neill, Director of Product Management at AIM Solder. “We are excited to collaborate with other industry leaders to drive advancements and support the development of cutting-edge technologies.”
As part of iNEMI, AIM Solder will engage in various projects focused on critical areas related to solder materials, electronics manufacturing, sustainable electronics, and more. These initiatives will not only benefit AIM Solder’s product development efforts but also contribute to the overall progress of the global electronics manufacturing landscape.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
10/31/2025 |Henger Microelectronics has reached a major milestone in its global expansion strategy with the successful shipment of advanced plasma etching and cleaning systems, along with automation equipment, to multiple countries and regions across Southeast Asia. This achievement marks a significant step forward in the company’s international growth and reinforces its position as a leading force in the global plasma equipment industry.
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
10/31/2025 | PRNewswireCephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.