Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
May 30, 2024 | BellEstimated reading time: 1 minute
Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program. The SPRINT program intends to design, build, and fly an X-Plane, an experimental aircraft to demonstrate enabling technologies and integrated concepts necessary for a transformational combination of aircraft speed and runway independence for the next generation of air mobility platforms. In Phase 1A, Bell executed conceptual design review and will move into preliminary design efforts for the SPRINT X-plane.
“Bell is honored to be selected for the next phase of this revolutionary program and ready to execute preliminary design,” said Jason Hurst, executive vice president, Engineering, Bell. “We completed our initial risk reduction efforts with our sled test demonstration at Holloman Air Force Base, and we look forward to building on this success with our continued work with DARPA.”
Bell completed risk reduction testing at Holloman Air Force Base in late 2023, showcasing folding rotor, integrated propulsion, and flight control technologies. Bell is building on its investment in High-Speed Vertical Takeoff and Landing (HSVTOL) technology and past X-plane experience to inform the X-plane development for this program.
Bell’s HSVTOL technology blends the hover capability of a helicopter with the speed (400+ kts), range, and survivability of jet aircraft. Bell has developed high-speed vertical lift technology for more than 85 years, pioneering innovative VTOL configurations like the X-14, X-22, XV-3 and XV-15 for NASA, the U.S. Army and U.S. Air Force, and continues to build on its proven history of fast flight from the Bell X-1.
Suggested Items
Bell Announces New Manufacturing Facility for the U.S. Army’s Future Long Range Assault Aircraft
12/18/2024 | BellBell Textron Inc., a Textron Inc. company, announced a facility site selection today to support production of the U.S. Army’s Future Long Range Assault Aircraft (FLRAA). The new 447,000 sq. ft. factory, located in the Denton County region of Fort Worth, Texas, will be dedicated to FLRAA component manufacturing. Bell plans to begin facility modification and equipment installation and achieve facility readiness for Low-Rate Initial Production (LRIP) by 2028.
Bell Announces Site Selection for Future Long Range Assault Aircraft Fuselage Assembly
11/06/2024 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, announced the site selection for the Future Long Range Assault Aircraft (FLRAA) fuselage assembly in Wichita, Kansas at an existing facility located at Beech Field on Textron Aviation’s East Campus near the site of Textron Aviation Defense. Bell plans to begin operations at the facility in the next several months.
The Next Chapter for Bell’s H-1 Helicopters Begins
04/01/2024 | Bell Textron Inc.The first Bell AH-1Z set to receive the Structural Improvement Electrical Power Upgrade (SIEPU) modification to be provided by Bell Textron Inc., a Textron Inc company, under a contract with the U.S. Marine Corps, has arrived at Bell’s Amarillo Assembly Center.
Bell Announces Bell 505 Dealership Agreement with Chinook Helicopters
02/29/2024 | Bell Textron Inc.Bell Textron, a Textron Inc. company, announced during the HAI Heli-Expo 2024 held in Anaheim, California, that it has appointed Chinook Helicopters as an authorized Bell 505 dealership serving western Canada. “With our 42-year history of flying Bell helicopters, we are enthusiastic about our relationship with a world-leading aircraft manufacturer and genuinely thrilled to be working alongside them,” said Cathy Press, CEO, Chinook Helicopters.
iNEMI LTS Tech Topic Series: Thermal Fatigue Performance in BiSn-Based Low-Temperature Solder Joints
01/31/2024 | iNEMIThere is an increasing interest in some market segments to use solder alloys with lower melting temperatures for electronics assembly. Low-temperature solder (LTS) can provide manufacturing, economic, and environmental benefits. Since 2015, the iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability project has been evaluating LTS paste formulations based on the Bi-Sn system.