DOCOMO Launches Japan's First Demonstration Experiment of Self-powered Hydropower Base Station
May 31, 2024 | JCN NewswireEstimated reading time: 1 minute
NTT DOCOMO, INC. announced that it launched Japan's first demonstration experiment(1) of a self-powered hydropower cellular base station on May 30. The experiment, which involves DOCOMO's hydroelectric power-generation system and a jet turbine developed by Professor Yukihiro Shimatani of the Prefectural University of Kumamoto, aims to prove the feasibility of a self-powered base station using water flowing in an irrigation canal, etc., as a sustainable, low-cost solution for mobile communication networks in rural areas.
Based on the results of this experiment, DOCOMO hopes to introduce a hydropower system for the sustainable operation of self-powered base stations in mobile communications networks by March 2025.
The jet turbine incorporates a nozzle that emits a stream of water, or "jet," to drive the turbine's rotation in the opposite direction and thereby generate electricity. While conventional hydroelectric systems use a separate nozzle and turbine, this device combines both components in a design so simple it can be manufactured with a 3D printer.
The newly developed hydropower system converts electricity into a form suitable for powering base stations. It also collects data on electric current, voltage and power, as well as water flow and pressure, which are then transmitted to DOCOMO's Energy Management System (EMS) platform to monitor and control power driving the base station. The platform also visualizes the amount of CO2 reduction realized with this sustainable hydropower system.
While DOCOMO's green base stations mainly use solar power, this initiative aims to use renewable energy such as hydropower in places where solar panels are not practical.
DOCOMO aims to achieve net-zero greenhouse gas emissions from its operations by 2030 and net-zero greenhouse gas emissions from its entire supply chain by 2040. Going forward, DOCOMO expects to increasingly adopt renewable energy as part of its commitment to decarbonization and the realization of a sustainable, carbon-neutral world.
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.Subscribe now to stay informed, competitive, and connected.
Suggested Items
Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
Beyond the Board: How a Diminished Supplier Base Affects Complex PCB Manufacturing Readiness in Defense
04/14/2026 | Jesse Vaughan -- Column: Beyond the BoardAs mil/aero electronics push toward higher density, tighter tolerances, and more complex constructions, another trend has unfolded in parallel. It receives far less attention but carries equal consequence: A significant reduction in the number of fabricators that can support complex PCB manufacturing.
The Pivotal Role of AI in Modern Electronics Manufacturing with Koh Young
04/03/2026 | Real Time with... APEX EXPOJoel Scutchfield, of Koh Young America shares how accurate, measurement-based data fuels AI engines for enhanced inspection, auto-programming, and defect classification. Joel emphasizes how self-correction capabilities and data sharing across production lines, driving towards a future of automated, defect-free manufacturing.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 2
02/16/2026 | Vern Solberg -- Column: Designer's NotebookAs the need grows for higher processing speed and the expanded functionality required for newer generations of central processing units (CPUs), the necessity for higher-density interconnect solutions is paramount. The current trend toward furnishing a single, monolithic system-level semiconductor package has become a serious yield issue in fabrication. For example, with all of the peripheral supporting functions on a single die platform, wafer fabrication yields are often below target and, although the CPU portion of a monolithic semiconductor may be perfect, if one or more of the supporting functions on the same die fails, the entire processor unit must be discarded.