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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.

HyRel Technologies’ Brian Watson to Present at SMTAI 2026

07/13/2026 | HyRel Technologies
Brian Watson, Managing Partner and Co-Founder of Hyrel Technologies, will present “The Challenges of Proper Tinning” at the 2026 SMTA International Conference and Exposition in Rosemont IL., Oct. 25-29, 2026.

Three Key Takeaways on Material Management From Cogiscan’s Latest White Papers

05/27/2026 | I-Connect007 Editorial Team
Effective material management has become increasingly critical as PCB assembly operations face mounting pressure to improve efficiency, control costs, and maintain quality in complex manufacturing environments. To help electronics manufacturers navigate these challenges, Cogiscan has contributed two complementary white papers to the I-Connect007 Industry Resource Center, offering practical strategies for improving material visibility, traceability, and production performance.

NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results

02/25/2026 | I-Connect007 Editorial Team
The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle. NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.

Ynvisible Collaborates with Global Automaker on New E-Paper Product

01/27/2026 | Ynvisible Interactive Inc.
Ynvisible Interactive Inc., a pioneer in sustainable and scalable e-paper displays and printed electronics, is pleased to announce a collaboration with a globally recognized automotive manufacturer to co-develop a new e-paper-based product for the automotive industry.
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