AIM Solder Appoints Mhanny Aguillo as Southeast Asia Technical Sales Manager
May 31, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the appointment of Mhanny Aguillo as the Southeast Asia Technical Sales Manager. With over 15 years of experience at AIM Solder, Mhanny brings a wealth of knowledge and expertise to his new role.
In this position, Mhanny will lead the growing technical sales team in Southeast Asia, alongside other recent additions, including Technical Sales Engineers Henry Colina, Wei Jye Lim, and Xuan Tung Le, as well as a new factory in Malaysia. This highlights our commitment to this vital and rapidly growing region. His extensive background in various roles within the company positions him to excel in this challenging role and drive significant growth for AIM Solder.
“We are excited to have Mhanny take on this new role," said David Suraski, Executive Vice President, Assembly Materials Division, "His dedication, deep understanding of the industry, and proven track record at AIM Solder make him the ideal candidate to lead our efforts in Southeast Asia. We are confident that under his leadership, we will continue to strengthen our presence and achieve our strategic goals in the region."
AIM Solder remains committed to providing superior products and unparalleled technical support, ensuring customers' success across the globe. This appointment is a testament to AIM's dedication to fostering talent from within and its commitment to maintaining its position as a market leader in solder assembly materials.
Suggested Items
Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration
09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. SwaminathanNear-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.
SMTA Carolinas Chapter Hosts Expert-Led Webinar: “Mastering Solder Paste Printing for Optimal SMT Assembly”
09/24/2024 | Koh YoungThe SMTA Carolinas Chapter invites you to attend an informative webinar on "Mastering Solder Paste Printing for Optimal SMT Assembly" on Tuesday, October 15, 2024, from 12:00 PM to 1:00 PM (Eastern).
Winners of IPC Hand Soldering and Rework Competition Vietnam 2024 Announced
09/19/2024 | IPCIn conjunction with NEPCON Vietnam 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Hanoi, Vietnam, September 11-13. Thirty-nine competitors from 16 electronics companies and one university in Vietnam vied for top honors.
Understanding Cleaning Challenges for Automated Solder Paste Dispensing
09/18/2024 | Debbie Carboni, KYZENIn today’s rapidly evolving electronics manufacturing landscape, staying abreast of innovative technologies is crucial. As solder paste and substrate materials continually evolve and become more complex, optimizing production methods with the latest technology ensures performance and quality while reducing operational costs.
Successful Rehm Technology Days 2024 – Where the Future Meets Technology
09/17/2024 | Rehm Thermal SystemsTraditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.