Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

iDEAL Semiconductor Announces Polar Semiconductor as Manufacturing Partner for SuperQ™ Power Devices

09/18/2025 | PRNewswire
iDEAL Semiconductor confirms that its ultra-efficient SuperQ™ silicon power devices are now in production at Polar Semiconductor, a leading foundry specializing in high-voltage, power, and sensor technologies.

Too Important to Ignore: Unpacking Advanced Packaging for AI Semiconductor – Report Summary

09/16/2025 | Futurum
Advanced packaging is becoming the cornerstone of AI semiconductor scaling, with 2.5D/3D integration, CoWoS, CPO, CoPoS, and SoW-X set to drive major gains in performance, bandwidth, and efficiency through the 2020s.

Advanced Packaging: Preparation is Now

09/15/2025 | Nolan Johnson, I-Connect007
In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.

AMD’s Lisa Su to Receive Inaugural SEMI Silicon Medal at SEMICON West 2025

09/08/2025 | SEMI
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the introduction of the annual SEMI Silicon Medal, a prestigious award that celebrates semiconductor industry icons driving innovation and excellence.

MSU Leveraging Intel 16 and the Cadence Tool Flow for Academic Chip Tapeout

08/22/2025 | Cadence Design Systems
Morgan State University (MSU) recently received an Apple Innovation Grant, designed to support engineering schools as they develop their silicon and hardware technologies. The New Silicon Initiative (NSI) is designed to inspire and prepare students for careers in hardware engineering, computer architecture, and silicon chip design.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in