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GlobalFoundries, Silicon Catalyst Partner to Accelerate Differentiated Technology Solutions for Semiconductor Startups

09/17/2024 | GlobalFoundries
GlobalFoundries (GF) and Silicon Catalyst, the world’s only incubator+accelerator focused exclusively on semiconductor solutions, today announced that GF has joined the incubator’s semiconductor startup ecosystem as a Strategic Partner and an In-Kind Partner (IKP).

Infineon Pioneers World’s First 300 mm Power Gallium Nitride (GaN) Technology

09/16/2024 | Infineon
Infineon Technologies AG announced that the company has succeeded in developing the world’s first 300 mm power gallium nitride (GaN) wafer technology.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week 

09/13/2024 | Marcy LaRont, PCB007 Magazine
At the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.

Polymatech, ECM Group Forge Strategic Joint Venture for Semiconductor Wafer Fabrication in Grenoble, France

09/12/2024 | PRNewswire
Polymatech, a multinational corporation (MNC), a leading player in semiconductor manufacturing with a strong presence in India and global business operations in USA, Singapore, Bahrain, UK and UAE announced the signing of a Memorandum of Understanding (MoU) with ECM Group, a globally recognised leader in advanced microelectronics and semiconductor technologies to establish a Joint Venture Company in Grenoble, France.

The Shaughnessy Report: Silicon to Systems—The Walls Are Coming Down

09/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
Traditionally, most designers of PCBs and ICs have operated in separate silos, unaware of much of what’s happening upstream or downstream. IC designers did their thing, and PCB designers did theirs, and everything worked. Until recently, that is.
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