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Pasternack Announces RFMW as New Preferred Channel Partner in the UK

03/31/2025 | Pasternack
After more than 16 years as a dedicated Pasternack channel partner in the United Kingdom, Spectech has announced its retirement and will close business operations on March 31, 2025.

American Made Advocacy: Reshoring—About Trust, Not Just Geography

03/25/2025 | Shane Whiteside -- Column: American Made Advocacy
In today’s chaotic political environment, you might have missed the fact that  Congress allocated nearly $3 billion to rip out and replace key components in America’s telecommunications networks. The funding is to remove equipment from networks nationwide because of cyberattacks on internet routers and cellular networks enabled by a Chinese company that makes more than half of the routers sold in the U.S. We know from prior experience and similar transgressions that we cannot trust that Chinese components aren’t being used for nefarious purposes.

MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025

03/12/2025 | MicroCraft
MicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.

Siemens Extends PAVE360 Technology to AMD GPUs Running on Microsoft Azure Cloud

03/11/2025 | Siemens
Siemens Digital Industries Software announced that it has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360™ technology for Software Defined Vehicle (SDV) development which is now available on AMD Radeon™ PRO V710 GPUs and AMD EPYC™ CPUs running on Azure, Microsoft’s cloud and AI platform.
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