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Koh Young Technology Showcasing Advanced Packaging Inspection Solutionsat SEMICON Japan

12/03/2024 | Koh Young Technology
Koh Young Technology, y, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.

AR, Automotive Applications to Drive Micro LED Chip Revenue to $489.5 Million by 2028

12/03/2024 | TrendForce
TrendForce reports that the revenue from Micro LED chips is projected to reach approximately US$38.8 million in 2024, with large displays remaining the primary source of contribution.

Koh Young Technology Showcasing Advanced Packaging Inspection Solutions at SEMICON Japan at Tokyo Big Sight

11/26/2024 | Koh Young Technology
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.

NEOTech Significantly Improves Wire Bond Pull Test Process

11/25/2024 | NEOTech
NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.

Nano Dimension Unveils 3D Printer for Micro Applications at Formnext

11/19/2024 | Nano Dimension
Nano Dimension, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announces the launch of its Exa 250vx Digital Light Processing (DLP) 3D Printer for micro applications. Developed to enable the creation of superior resolution micro parts at high production throughput,  the high-speed Exa was unveiled today for the first time globally at Formnext in Frankfurt, Germany (Hall 11, Stand D22).
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