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Siemens Extends Veloce with Innexis Shift-Left Software

11/07/2024 | Siemens
Siemens Digital Industries Software announced the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

Why a Culture of Thriving Matters

08/30/2024 | Audrey McGuckin, The McGuckin Group
On every call with senior leaders, I hear the same thing: Their organizations are facing the cumulative fatigue of constant disruptions. Crises from the pandemic to the war in Ukraine to supply-chain issues—coupled with pressures from return to work and constant transformation efforts—have led to widespread burnout. In The Devil Never Sleeps, author Juliette Kayyem argues that the world we now live in will always have some level of disruption, making conditions tough for organizations and individuals.

MKS’ Atotech and ESI Participate in Electronics Circuit Asia in Thailand

07/25/2024 | Atotech
MKS Instruments announces its participation at the Electronics Circuit Asia 2024 in Thailand, July 24-26, highlighting its leading brands Atotech® and ESI® and related advances in advanced packaging, package substrate, and printed circuit board manufacturing.

Magnachip Mixed-Signal Unveils Power Management IC and Level Shifter for Display Panels in IT Devices

06/11/2024 | Magnachip Semiconductor
Magnachip Mixed-Signal, Ltd. announced the release of a multi-functional Power Management Integrated Circuit (PMIC) and a multi-channel level shifter to regulate different voltages and signals within display panels in IT devices.
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