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Industry-Wide Memory Constraints Grow as AI-Driven Supply Shift Reshapes Market

04/13/2026 | Global Electronics Association
Artificial Intelligence is consuming a growing share of the world’s memory supply, leaving electronics manufacturers across industries facing longer lead times, rising prices, and increasing uncertainty, according to a new report released today from the Global Electronics Association.

ASTER and Siemens: Design for Test Gets ‘Real’

04/02/2026 | Nolan Johnson, I-Connect007
For more than 30 years, ASTER Technologies has been a leader in PCB assembly test verification and engineering software. Siemens Digital Industries Software and ASTER Technologies’ recent merger represents the third strategic acquisition by Siemens in the space between design and manufacture. We spoke with ASTER Technical Director Will Webb, Michael Alam, head of corporate development for Siemens’ Electronic Board Systems Group, and Patrick Hope, Valor marketing specialist at Siemens, about the strategy and vision that’s bringing all these post-layout tools into the design workflow.

Elementary Mr. Watson: Where the PCB Ends and Advanced Packaging Begins

01/29/2026 | John Watson -- Column: Elementary, Mr. Watson
Change sits at the center of almost everything in PCB design. From the earliest days of printed circuits to today’s highly integrated electronic systems, stability does not define this discipline; evolution does. Materials change, component geometries shrink, signal speeds increase, and manufacturing processes advance. With each shift, we reshape the role of the PCB designer, sometimes quietly, and other times in a way that feels like a freight train driving through your living room.

The Power of Onshoring High-tech Thermal Control

12/02/2025 | Brian Buyea, Remtec
In advanced electronics, thermal management has become the silent determinant of performance. As devices shrink and power densities soar, how we handle heat defines not only the reliability of a system but also the pace of innovation itself. High-tech thermal control is no longer a supporting role, but a core enabler of modern technology, encompassing power modules and RF devices, as well as electric vehicles and medical systems.

Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium

11/05/2025 | Real Time with...SMTAI
In this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.
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