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Advancing PCB Technology: A Conversation With John Johnson
June 4, 2024 | Barry Matties, Publisher, I-Connect007Estimated reading time: Less than a minute
John Johnson, an industry veteran with 45 years of experience, shares insights on the adoption of the Averatek process at American Standard Circuits, highlights the shift toward finer lines and spaces in PCB manufacturing, and emphasizes the importance of technology, cleanliness, and material adhesion in achieving ultra-fine lines. He addresses the challenges in advancements of the additive process, emphasizing the need for a mindset shift and employee training. His outlook on the future of PCB technology in North America underscores the growing demand for innovative solutions and the importance of domestic production.
This interview originally appeared in the May 2024 issue of PCB007 Magazine.
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Blueshift Launches PhaseBlue 1500 Series Circuit Material
09/22/2025 | BlueshiftBlueshift, a U.S.-based technology leader in advanced materials, is introducing PhaseBlue® 1500, the first product in its Series Circuit Materials (SCM) line at this year’s (2025) European Microwave Show.
Standard of Excellence: Anticipating Customer Needs Early and Often
03/26/2025 | Anaya Vardya -- Column: Standard of ExcellenceSuccessful companies don’t simply respond to customer needs, they anticipate them. The heart of excellent customer service lies in being proactive, where businesses foresee challenges, provide solutions, and create opportunities before customers know they need them. Here are seven ways to anticipate customer needs and implement them to ensure successful outcomes.
Scanfil Is Preparing for a Changing Trading Environment
03/19/2025 | ScanfilAs the potential for new tariffs continues to evolve, Scanfil is committed to ensuring that its global manufacturing network is prepared to offer support should the need arise for a shift of manufacturing locations, whether domestically or internationally.
Siemens Extends Veloce with Innexis Shift-Left Software
11/07/2024 | SiemensSiemens Digital Industries Software announced the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.
DELO Introduces UV-approach for Fan-out Wafer-level Packaging
10/25/2024 | DELODELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.