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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Scanfil Is Preparing for a Changing Trading Environment
March 19, 2025 | ScanfilEstimated reading time: 1 minute
As the potential for new tariffs continues to evolve, Scanfil is committed to ensuring that its global manufacturing network is prepared to offer support should the need arise for a shift of manufacturing locations, whether domestically or internationally. Our strategically positioned global manufacturing facilities are designed to mitigate any disturbances caused by forthcoming tariff implementations. By leveraging these locations, we can provide cost-effective alternatives while maintaining the quality and efficiency our customers expect from us.
In recent years, we have invested significantly in expanding and enhancing our manufacturing capabilities and footprint. This includes establishing new manufacturing locations and increasing space and capabilities in various regions. Considering tariffs, production timelines, logistics, and supply chain optimization, we are prepared to evaluate the most suitable manufacturing sites based on customer needs. Our dedicated team is committed to ensuring a smooth transition to these alternative locations, should you find it necessary to shift your supply chain and manufacturing. We will work closely with you to mitigate all impacts.
New tariffs may result in adjustments to pricing for some of our services. We understand the importance of transparency and want to ensure you are aware of potential changes before they occur. Please stay closely connected with us regarding this matter and let us know if you’d like to discuss further or explore specific options.
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Sweeney Ng - CEE PCBSuggested Items
Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.
Foxconn, TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/30/2025 | PRNewswireHon Hai Technology Group (Foxconn) and TECO Electric & Machinery Co Ltd Ltd (TECO) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.