Aismalibar to Attend PCIM 2024
June 5, 2024 | AismalibarEstimated reading time: 1 minute
Aismalibar will be attending PCIM 2024 in Nuremberg, Germany from June 11th to 13th, presenting new cooling technologies for power electronics, specifically Thermal Interface Materials (TIMs) and Insulated Metal Substrates (IMS). PCIM is the leading international exhibition and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. The exhibition and conference are the international meeting point for the industry. Aismalibar will exhibit in booth 449 Hall 9 of the Nuremberg Exhibition Grounds.
Aismalibar Thermal Interface Materials have been designed to improve dielectric isolation and fast thermal transmission in power electronics and battery packs among others, taking into consideration cost reduction, lifetime performance, safety, and reliability.
Thermal Interface Materials are divided into two main areas, differentiated based on whether they need dielectric capacity. The dielectric requirement is determined by the electronic device, its operating voltage, and the applicable regulations regarding ground insulation. Additionally, Aismalibar has developed a series of applicable surfaces on the TIMs, differentiated by whether they need to be self-adhesive. Both surfaces serve, in turn, to reduce the air cavities that exist between the surfaces of the TIMs and the heatsinks or electronic components.
Aismalibar has a wide range of thermal management solutions, but this year it will focus on presenting the following new products:
- The BOND SHEET CURED GLASS FREE is used for Thermal Interface material in power electronics and battery isolation with 3,2w/mK and 4 to 6Kv dielectric strength.
- Thermal FR4 used in PCB manufacturing to improve thermal management and reduce thermal vias. The use of the Aismalibar thermal FR4 can reduce a 15% d the operating temperature of power components by improving the output or extending the life of the component.
- Insulated Metal Substrate COBRITHERM ULTRATHIN 5W and 8W used in high-end power AC/DC converters and high-power LED industry.
- And COBRITHERM ALP, made from an Aluminium base coated with a 100-micron dielectric ceramic layer with extra low thermal resistance and high dielectric strength up to 6KV. It is ideal for building battery housing, covers, partitions or radiators, power electronics and comfortable heat sinks, among other solutions. It is completely insulated and guarantees excellent contact between the battery and dissipation elements.
Suggested Items
Advancements in Thermal Management: Material Talk With DuPont
02/06/2025 | Marcy LaRont, I-Connect007As our DesignCon coverage continues, this insightful discussion featuring Mike Kwasny, business development manager at DuPont, delves into technologies and innovations in electronics manufacturing featuring their unique material solutions, including their Kapton film and Pyralux laminate lines.
Indium Expert to Address Thermal Challenges at TestConX 2025
02/04/2025 | Indium CorporationIndium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Advanced Chip and Circuit Materials Shows 224 Gb/s Laminates and Prepregs at DesignCon 2025
01/27/2025 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) will be showing its high-performance circuit materials, including its Celeritas Series laminates and prepregs at the DesignCon 2025 exhibition.
ACCM Launches CeleritasSF & CeleritasBU for Ultra-High-Speed PCBs
01/27/2025 | PRNewswireAdvanced Chip and Circuit Materials Inc. (ACCM), a US-based manufacturer of skew free, ultra-thin copper-clad laminates and dielectric prepreg materials used to fabricate high layer count PTH, Buildup and UHDI multilayer printed circuit boards (PCBs), announced the introduction of the CeleritasSF and CeleritasBU series of laminates and prepregs, which enable PCIe Gen 6 & 7 and data rates of 224 Gb/s per channel.