Beyond the Board: Early Engagement Means Faster Prototyping for Defense Programs
Defense Speak Interpreted: The Autonomous Plane Battle—Skyborg Vs. Loyal Wingman
American Made Advocacy: Congress Back from Break With Work To Do
An IPC ‘Blockbuster’: IPC-7711/21
June 11, 2024 | Teresa Rowe, IPC Senior Director, Assembly and Standards TechnologyEstimated reading time: 1 minute
Dan Foster, Missile Defense Agency, has been instrumental in developing IPC-7711/21, Rework, Modification and Repair of Electronics Assemblies, over several revisions of this important guideline document. We talked to Dan and committee member Agnieszka Ozarowski, BAE Systems, about the most recent revision.
IPC-7711/21 is the replacement guideline for IPC-R-700C, a document last updated in 1989. In 1998, Dan led the first meeting for the creation of IPC 7711/21 and recalls why R-700 needed to be updated.
“We were using, like, two hair dryers to remove components by hot air at that time,” he says.
Technology had changed, and R-700 needed to be replaced. IPC-7711/21 is different from others in the IPC library. It is a guideline, not a standard, offering information on how to do rework and repair on boards and assemblies. IPC-7711/21D provides easier-to-follow guidelines, new visual aids, procedures, tools, methods, and materials for restoring electronic assemblies.
Each procedure has been reformatted to make it easier for the reader to understand, and the format is more in line with standards.
“The big thing about 7711/21 is that it has procedures, but they are flexible,” Dan says. “We wanted to give people core procedures to use, and those can be modified. People tend to treat it like a standard, and we need to remind them that it is not.”
The first thing he tells others is to read the front of the book. “Nobody wants to, but we changed procedures with a simple note up front, stating whether procedures will work for lead or lead-free,” Dan says. “But you need to understand the features—different fluxes and higher temps. We refer to all that in the front of the document. In revision D, you will see many changes to the General Information section of the document. Team Iron, the A-Team responsible for the content, worked to bring it up to date.”
To read the entire article, which appeared in the Spring 2024 issue of Community Magazine, click here.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.