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iNEMI and MIT Conduct Survey on Optical Adhesives for High-Volume Photonics

01/21/2025 | iNEMI
The International Electronics Manufacturing Initiative (iNEMI), in conjunction with MIT's FUTUR-IC initiative, is conducting a survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics.

LiDAR Market Projected to Reach US$5.352 Billion by 2029 Thanks to Advanced Autonomous Driving and Logistics Demand

01/20/2025 | TrendForce
TrendForce’s latest report, “2025 Infrared Sensing Application Market and Branding Strategies,” reveals that LiDAR is gaining traction in automotive markets—including passenger vehicles and robo-taxis—as well as in industrial applications such as robotics, factory automation, and logistics.

TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)

01/16/2025 | TopLine Corporation
TopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.

NAMICS Brings Innovative Thermoset Materials to PCB Fabrication

01/16/2025 | Andy Shaughnessy, Design007 Magazine
At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.

Indium to Showcase Precision Gold Solder Solutions at MD&M West 2025

01/08/2025 | Indium Corporation
Indium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MD&M West, taking place February 4-6 in Anaheim, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
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