-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
eCADSTAR Sets New Standards for Compact PCB Design with Etched Inductor Parts
June 12, 2024 | ZukenEstimated reading time: 1 minute

Zuken announces the 2024 release of eCADSTAR, Zuken’s next-generation PCB design system for small and medium businesses. The new release includes a number of improvements ranging from enhanced design reuse, simplified revision tracking and more robust schematic design.
eCADSTAR 2024 supports PCB designers in meeting the increasing demand for compact, high-performance, energy-efficient, and environmentally friendly electronic devices. Addressing the challenge of limited PCB space, the 2024 release optimizes the placement of etched resistors on inner layers, essential for the termination of critica signals. The intuitive footprint editor allows for easy customization of size and shape, ensuring accurate resistance values and enhancing design efficiency.
Design Comparison Capability for Revision Tracking
The new release introduces a comprehensive design comparison capability that allows designers to easily identify differences between two PCB or schematic designs. This feature is invaluable for understanding revisions made over time, especially when the documentation of
changes is deficient. In addition, the shape comparison tool aids in reverse engineering efforts by highlighting discrepancies in copper and routing patterns.
Efficient Component Transfer
The new "Copy Complete Part" feature allows designers to effortlessly transfer a component, along with its comprehensive set of data including PCB footprint, schematic symbol, padstacks, and 3D model, from a customer-specific or prototype library to a central library directly to a customer-specific library in a single action. This capability not only saves valuable time, but also ensures consistency and accuracy in the design process - a significant improvement over the piece-by-piece transfer processes of the past.
Schematic Updates for Improved Design Experience
eCADSTAR Schematic has received several updates to improve the design experience. The documentation enhancements now include support for variant text. The drawing of nets and buses has been optimized to make the process of connecting components much easier. In addition, the introduction of new Design Rule Checks (DRCs) helps identify potential problems early on, streamlining the design process, reducing overall design time, and minimizing the need for later revisions.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).