Driving Innovation: Mechanical and Optical Processes During Rigid-flex Production
It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
eCADSTAR Sets New Standards for Compact PCB Design with Etched Inductor Parts
June 12, 2024 | ZukenEstimated reading time: 1 minute
Zuken announces the 2024 release of eCADSTAR, Zuken’s next-generation PCB design system for small and medium businesses. The new release includes a number of improvements ranging from enhanced design reuse, simplified revision tracking and more robust schematic design.
eCADSTAR 2024 supports PCB designers in meeting the increasing demand for compact, high-performance, energy-efficient, and environmentally friendly electronic devices. Addressing the challenge of limited PCB space, the 2024 release optimizes the placement of etched resistors on inner layers, essential for the termination of critica signals. The intuitive footprint editor allows for easy customization of size and shape, ensuring accurate resistance values and enhancing design efficiency.
Design Comparison Capability for Revision Tracking
The new release introduces a comprehensive design comparison capability that allows designers to easily identify differences between two PCB or schematic designs. This feature is invaluable for understanding revisions made over time, especially when the documentation of
changes is deficient. In addition, the shape comparison tool aids in reverse engineering efforts by highlighting discrepancies in copper and routing patterns.
Efficient Component Transfer
The new "Copy Complete Part" feature allows designers to effortlessly transfer a component, along with its comprehensive set of data including PCB footprint, schematic symbol, padstacks, and 3D model, from a customer-specific or prototype library to a central library directly to a customer-specific library in a single action. This capability not only saves valuable time, but also ensures consistency and accuracy in the design process - a significant improvement over the piece-by-piece transfer processes of the past.
Schematic Updates for Improved Design Experience
eCADSTAR Schematic has received several updates to improve the design experience. The documentation enhancements now include support for variant text. The drawing of nets and buses has been optimized to make the process of connecting components much easier. In addition, the introduction of new Design Rule Checks (DRCs) helps identify potential problems early on, streamlining the design process, reducing overall design time, and minimizing the need for later revisions.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.