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Camtek Receives a $20M Order from a Tier-1 OSAT

07/10/2024 | Camtek
Camtek Ltd., announced that it has received a new multiple-systems’ order for a total of $20 million from a tier-1 Outsourced Semiconductor Assembly & Test (OSAT), for the inspection and metrology of Advanced Packaging applications. The systems are expected to be delivered in the second half of 2024.

Altus Enhances Sustainability with kolb’s Recyclable Packaging

07/09/2024 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, is pleased to announce that its pre-eminent supplier, kolb Cleaning Technology, has transitioned to fully recyclable packaging for several of their cleaning products.

Demand from AMD and NVIDIA Drives FOPLP Development, Mass Production Expected in 2027–2028

07/05/2024 | TrendForce
 In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

Custom Interconnect Ltd Shortlisted in The Electronics Industry Awards in Three Categories

07/03/2024 | Custom Interconnect Ltd
Well done to the team at Custom Interconnect Ltd for being short listed for the two business awards “Electronics Manufacturer of the Year” and “Excellence in Innovation” and Symon Franklin for Industry personality award for his work with IPC Standards, at this year’s national The Electronics Industry Awards.

Silicon Box Selects Piedmont to Host €3.2B Chip Foundry for Italian Expansion

07/02/2024 | Silicon Box
The co-founders of Silicon Box, CEO Dr. Byung Joon (BJ) Han, Dr. Sehat  Sutardja, and Weili Dai, together with the Minister Adolfo Urso, Presidente Alberto Cirio of  the Piedmont region, and Mayor Alessandro Canelli of the municipality of Novara  announced that Novara in Piedmont will be the site of the company’s new, first-of-a-kind  advanced semiconductor packaging and testing foundry.
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