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Advanced Electronics Packaging Digest

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The Chemical Connection: Employee and Operator Empowerment in the Age of AI

10/04/2026 | Don Ball -- Column: The Chemical Connection
In an ideal world, every operator would understand the process they are working on and be able to diagnose problems and suggest improvements. In the real world, however, we all know that these types of people are, if not rare, at least in the minority. Where do these people fit in when everyone is turning to automation and AI for quality and yield improvements and cost reduction? (Never lose sight of the fact that, in the end, it’s always about the money.) In my opinion, these people are valuable resources, and every effort should be made to retain them, regardless of their education level or seniority.

Mexico’s Manufacturing: A Story Bigger Than Nearshoring

09/16/2026 | I-Connect007 Editorial Team
Mexico’s electronics manufacturing story is often reduced simply to nearshoring. But companies operating within the country’s manufacturing ecosystem describe a market moving beyond its reputation for cost-competitive assembly. They see deeper capabilities in engineering, automation, technical services, supplier integration, digitalization, and advanced manufacturing under development. And they want the world to know. For SMT007 Magazine, we asked six organizations at different positions along the manufacturing value chain to share their vision. We asked them to describe their companies, the value they bring to customers, where they see growth, and how Mexico’s place in global manufacturing is changing.

Foxconn Expands U.S. AI Footprint With California Property Acquisition

08/28/2026 | I-Connect007 Editorial Team
Foxconn is expanding its U.S. presence with the acquisition of land and a manufacturing facility in Santa Clara, California, as the electronics manufacturing giant continues to invest in AI-related business.

North American EMS Shipments Rise 6.7% in June as Book-to-Bill Reaches 1.33

07/29/2026 | Global Electronics Association
The Global Electronics Association announced today the June 2026 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.33.

BOOK EXCERPT: The Printed Circuit Assembler’s Guide to...Design for Test, A Practical Guide to Test and Inspection, Chapter 1

06/04/2026 | I-Connect007
Over the last two to three decades, the electronics industry has experienced a significant transformation. Circuit card assembly (CCA) and printed circuit board (PCB) design have become highly automated and digitized, allowing for faster development and increased design reuse. Engineers can now easily build on existing, proven architectures. Despite these advancements, one key area often falls behind: test and inspection.
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