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Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production

12/23/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.

Siemens’ Solido SPICE Now Certified for Multiple Leading-edge Samsung Foundry Processes

11/27/2024 | Siemens Digital Industries Software
Siemens Digital Industries Software announced that its continued collaboration with longtime customer Samsung Foundry has established a host of new certifications for its recently introduced Solido™ SPICE software, which supports the verification of next-generation analog, mixed-signal, RF, memory, library IP and 3D-IC semiconductor designs. 

DuPont Earns Best Partner Award for Innovation from Samsung Electronics

10/31/2024 | DuPont
DuPont announced it has been selected for the 2024 Best Partner Award from Samsung Electronics in the Innovation category.

KDDI Selects Samsung To Deploy Open RAN Powered by Virtualized RAN in Japan

10/21/2024 | Samsung
Samsung Electronics announced that the company has been selected by KDDI as a main vendor to provide 4G and 5G O-RAN compliant virtualized Radio Access Network (vRAN) solutions for their Open RAN deployment in Japan.

Samsung Starts Mass Production of Industry’s Most Powerful PC SSD Optimal for AI Applications

10/04/2024 | BUSINESS WIRE
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, announced it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry’s highest performance and largest capacity.
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