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Element Solutions Increases Q2, Full Year Guidance
June 17, 2024 | Element Solutions Inc.Estimated reading time: Less than a minute
Element Solutions Inc announced that it is raising its guidance range for the second quarter and full year 2024. ESI now expects adjusted EBITDA to be approximately $135 million in the second quarter and between $530 million and $545 million for the full year.
President and CEO Benjamin Gliklich said, "The strength in our electronics business and improvement in our overall profitability have continued and, in certain areas, accelerated in the second quarter. Our wafer level packaging and circuitry businesses, in particular, have ramped to support strong customer growth these past two months. While electronic markets are recovering in certain pockets, overall unit and chemistry volumes remain below long-term trend levels. Nonetheless, and despite what is a generally weaker industrial environment, we expect in 2024 to generate record adjusted EBITDA since the founding of Element Solutions in 2019. This bodes well for our earnings trajectory next year and beyond. Our conviction in ESI’s longer-term outlook continues to strengthen."
Updated 2024 Guidance
The Company has increased its full year 2024 adjusted EBITDA expectation from a range of $515 million to $530 million to an updated range of $530 million to $545 million. In addition, the Company now expects 2024 adjusted EPS to be in the range of $1.40 to $1.46.
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Rachael Temple - AlltematedSuggested Items
AGC's Advanced PCB Material Solutions
04/17/2026 | Real Time with... APEX EXPOAGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.
Indium Faces Complex Soldering Head On
04/17/2026 | Real Time with... APEX EXPOKevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.
Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards
04/17/2026 | Real Time with... APEX EXPOAt APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
At KYZEN, Cleaning is All About Reliability
04/17/2026 | Real Time with... APEX EXPOJason Schwartz discusses KYZEN's advanced cleaning solutions for PCB assembly with Dan Beaulieu at APEX EXPO 2026. KYZEN has a 35-year legacy in defluxing, innovative real-time process control, and commitment to ensuring electronic reliability. How KYZEN partners with manufacturers through process audits and lab testing to maintain optimal cleaning standards is part of this conversation.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.