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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Real Time with... SMTAI 2026: Koh Young's Advances in AI-Assisted Inspection and Customer Support

11/11/2026 | Real Time with...SMTAI
In this interview from SMTAI 2026, Joel Scutchfield discusses how Koh Young is expanding its Americas organization to support growth in AI, data centers, and other electronics markets. He describes AI-assisted programming, Smart Review, and automated feedback tools designed to reduce programming time, limit false calls, and improve production efficiency.

I-Connect007 Welcomes Dr. Cody Schoener as Newest Mil/Aero Columnist

11/09/2026 | I-Connect007
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FSQuality in Thailand: From Automotive and Industrial Controls to AI and Optical Modules

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FSQuality Circuits to Exhibit at electronica 2026 in Munich, Germany

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Thailand-Based Advanced PCB Manufacturer to Showcase High-Density Interconnect Technology, High-Layer-Count PCBs, and China-Plus-One Global Manufacturing Solutions.

I-Connect007 Releases Episode 5 of ‘On the Line With… Qnity: Engineering What’s Next’ Podcast Series

11/04/2026 | I-Connect007
I-Connect007 announces the release of the fifth episode in its six-part podcast series, On the Line With… Qnity: Engineering What’s Next. This latest installment, titled “Engineering Heat Out of High-Power Systems,” examines the increasingly critical role of thermal management in electronics design and how innovative materials are enabling higher performance, greater reliability, and improved safety.
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