-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Exhibitor Registration Opens for 2024 NEDME Expo
June 17, 2024 | NEDMEEstimated reading time: 1 minute
The Electronics Manufacturers Association of Oregon (EMA) and the Electronics Representatives Association (ERA) are delighted to announce that Exhibitor registration for the 2024 NW Electronics Design & Manufacturing Expo (NEDME) is now open. The expo will take place on Wednesday, October 30, 2024, from 8:00 AM to 4:00 PM at the Wingspan Event & Conference Center at Westside Commons in Hillsboro, Oregon. This is the first year that the event will be held at this newer, larger event center.
NEDME stands as the Pacific Northwest’s premier event for electronics manufacturing professionals, offering a unique opportunity to explore the latest industry trends and innovations. The event will feature dynamic exhibits, insightful keynote presentations, technical sessions, and ample networking opportunities, making it an essential gathering for anyone involved in the electronics sector.
Those interested in exhibiting can reserve booth space by registering at www.nedme.com or contacting the EMA at board@nedme.com. Sponsorship opportunities are also available for companies looking to enhance their visibility within the manufacturing community. Lock in your booth now.
Start spreading the news that registration for attendance will open soon, an opportunity to see what NEDME is all about and to connect, learn, and drive innovation in the electronics industry. As always NEDME has a long standing tradition of donating a portion of the proceeds from admissions to the Oregon Food Bank.
Event Details:
- Date: Wednesday, October 30, 2024
- Time: 8:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center at Westside Commons, Hillsboro, Oregon
We look forward to seeing you there!
Contact Information:
- Exhibitors and Sponsorships: board@nedme.com
- Website: www.nedme.com
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/16/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.