SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million
June 17, 2024 | SEMIEstimated reading time: 1 minute
FlexTech, a SEMI Technology Community, issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by grant recipients to cover total project cost.
The RFP seeks proposals targeting FHE advances in the following areas:
- Development of Novel Materials, Additive Processing, and Printed Electronics for Harsh Environments
- Advancement in High-Density, Multi-Layer Interconnect Technology for Ultra-Narrow Linewidth and Spacing, FHE and Hybrid Electronics Packaging
- Advanced Design and Modeling Tools for FHE
- FHE Manufacturing, Standards, and Reliability
- Other (Restricted Open Topics)
- Sensing
- AI/ML Applications
- Thermal Management
Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths including team diversity. See the SEMI FlexTech 2024 Request for Proposals for more details on the evaluation process.
White Paper Submissions
White paper submissions, the first step in responding to the RFP, are due July 21, 2024. Following the review of white papers by the RFP review committee, FlexTech will invite selected organizations to submit full proposals. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:
- Rationale
- Budget
- Collaboration value
- Dual-use (industry and military) applicability
- Relevance to the FHE ecosystem
- Schedules and milestones
- Reasonable and stretch deliverables
- Overall proposal quality
- Request for Proposals Webinar
To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on June 24, 2024, at 10:00am PDT. A recording will be available for registrants unable to attend the event.
Suggested Items
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
NVIDIA RTX PRO 6000 Shipments Expected to Rise Amid Market Uncertainties
06/24/2025 | TrendForceThe NVIDIA RTX PRO 6000 has recently generated significant buzz in the market, with expectations running high for strong shipment performance driven by solid demand.
Green Circuits Boosts Test Capacity with New Takaya APT-1600FD System
06/24/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the purchase of its fourth Takaya APT-1600FD Double-sided Flying Probe Test System.
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
France, Spain Renew Commitment to the Airbus A400M Programme
06/17/2025 | AirbusAirbus and OCCAR have reached an agreement with the A400M launch nations to secure production for the programme for the foreseeable future, improve the cost of operations, and jointly develop new capabilities.