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Biden-Harris Administration Announces First CHIPS Award to Polar Semiconductor, Establishing U.S. Foundry

09/25/2024 | NIST
As part of the Biden-Harris Administration’s Investing in America agenda, the U.S. Department of Commerce announced its first award under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities of up to $123 million in direct funding to Polar Semiconductor (Polar).

Northrop Grumman, Lithuania to Collaborate on Allied Defense Industrial Cooperation

09/23/2024 | Northrop Grumman
Northrop Grumman Corporation and the Ministry of Defence and Ministry of Finance of the Republic of Lithuania signed a Memorandum of Understanding (MOU) formalizing their intention to work together to support Lithuanian industry in their ability to produce medium-caliber ammunition for Infantry Fighting Vehicles.

Jabil to Expand Operations in India

09/10/2024 | Jabil
Jabil Inc. announced it has signed a Memorandum of Understanding (MoU) with the Tamil Nadu state government as part of the company’s planned expansion in Tiruchirappalli, Tamil Nadu, India.

DELO Proves Feasibility of Adhesives as Soldering Alternatives for MiniLEDs, Predicting Future MicroLED Integration

09/09/2024 | DELO
DELO has conducted in-house feasibility studies, electrically and mechanically connecting miniLED dice using directional conductive adhesives.

AIM to Present on Ultra-Miniature Assembly for Mini/MicroLEDs at MicroLED Connect

09/03/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming MicroLED Connect Conference and Exhibition taking place September 25-26 in the Conference Center at High Tech Campus Eindhoven in The Netherlands. 
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