CityUHK, Foxconn’s Hon Hai Research Institute Establish a Joint Research Centre
June 20, 2024 | FoxconnEstimated reading time: 1 minute
City University of Hong Kong (CityUHK) and the Hon Hai Research Institute of the Hon Hai Technology Group (Foxconn) jointly established the Foxconn-CityUHK Joint Research Centre. The aim of the centre is to combine the scientific research efforts of industry and the academic sector to advance innovative research projects in artificial intelligence, semiconductor, next-generation communications, information security and quantum computing.
The opening ceremony of the joint research centre was held on 12 June. Officiating guests included Professor Freddy Boey, President of CityUHK; Dr Lee Wei-bin, Chief Executive Officer and Director of the Information Security Research Centre of the Hong Hai Research Institute; Professor Ma Wei Ying, Huiyan Chair Professor and Chief Scientist of the Institute of AI Industry Research at Tsinghua University; Professor Kuo Tei-wei, Chief Technology Officer, Delta Electronics; Professor Lee Chun-sing, Provost and Deputy President of CityUHK; and Professor Wang Jianping, Associate Provost (Academic Affairs) of CityUHK and Director of the joint research centre, among others.
Speaking at the opening ceremony, President Boey said, “We are honoured that CityUHK has been chosen as the first university partner of the Hon Hai Research Institute globally to work together to establish a joint research centre. This collaboration signifies the shared vision of CityUHK and the Hon Hai Research Institute to address the challenges of our times through innovative research. The joint research centre will serve as a collaborative platform for the elites from industry and the academic sector to nurture innovative ideas and advance the development of innovation and technology.”
Dr Lee said, “The Hon Hai Research Institute will continue to work closely with CityUHK. We hope that the joint research centre will contribute to breakthroughs in the future development of innovation and technology.”
CityUHK representatives and the Hon Hai Research Institute delegation visited the joint research centre after the opening ceremony to conduct further discussions on the future direction of the centre.
Officiating at the opening ceremony of the Foxconn-CityUHK Joint Research Centre are President Boey (third right), Dr Lee (third left), Professor Ma (second left), Professor Kuo (first left), Professor Lee (second right) and Professor Wang (first right).
Attending the opening ceremony of the Foxconn-CityUHK Joint Research Centre are President Boey (seventh right), Dr Lee (seventh left), CityUHK representatives and the Hon Hai Research Institute delegation.
Suggested Items
Rohde & Schwarz Joins AI-RAN Alliance and Leverages its T&M Expertise to Unlock Potential of AI for Wireless Communications
06/25/2024 | Rohde & SchwarzRohde & Schwarz has become the latest member of the recently formed AI-RAN Alliance. As a global leader in wireless testing, the company will contribute its T&M expertise to this new collaborative initiative, which aims to integrate artificial intelligence (AI) into wireless communications to advance radio access network (RAN) performance and mobile networks.
Mek Celebrates Two Years in Prestigious ITEA Project ExplAIn, Supported by EUREKA and EU
06/25/2024 | MEKMek (Marantz Electronics), a leading provider of Automatic Optical Inspection solutions, proudly marks two years of participation in the ExplAIn project, an innovative initiative organized by ITEA and supported by EUREKA and the European Union.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/21/2024 | Marcy LaRont, PCB007 MagazineHe’s back, and in splendid form. Pete’s Starkey’s coverage of the EIPC Summer Conference, which took place June 4-5 at the European Space Centre, The Netherlands, is top notch. Joan Tourné from NextGIn Technologies emphasized that our attention must be focused on the interconnection ability of our PCBs and highlights VeCS as an alternative to the traditional plated-through-hole approach. Finally, Martyn Cauwe of IMEC discusses environmental impact and specifically, the need for a better, parametric approach to quantifying it, something European businesses are being required to do on the regular.
TRI Expands with New Office in Guadalajara, Mexico
06/19/2024 | TRITest Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, recently opened a new office in Guadalajara, Mexico, to accommodate the industry's rapid growth.
Manufacturing Industry's Path to Innovation and Efficiency Lies in Exponential IT, Says Info-Tech Research Group
06/18/2024 | Info-Tech Research GroupFacing heightened competition, aging legacy equipment, and significant technical debt, the manufacturing sector is under immense pressure to innovate and modernize its operations, Info-Tech Research Group explains in a new industry resource.