Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Meet New Engineer Jess Hollenbaugh 

11/21/2024 | Andy Shaughnessy, I-Connect007
At PCB West, I spoke with Jess Hollenbaugh, a recent college graduate who has now joined Polar Instruments. In this interview, she shares her journey from a physics student focused on high-energy astrophysics to her new role at Polar. Her insights provide a glimpse into the dynamic opportunities awaiting those who venture into this evolving industry.

TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

10/28/2024 | ANSYS
Ansys was recognized at the TSMC 2024 Open Innovation Platform® (OIP) Partner of the Year awards for excellence in design enablement for AI, HPC, and photonics silicon systems.

Young Expert 'Cleanroom Ralph' Explains Microelectronics for AT&S

10/17/2024 | AT&S
AT&S, the global microelectronics company based in Styria, is launching a smart new information campaign with “Cleanroom Ralph”, the country’s youngest technology expert. In several short, easy-to-understand videos, seven-year-old Ralph from Styria explains the most important concepts from the world of microelectronics.

TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

09/27/2024 | ANSYS
Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.

Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration 

09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. Swaminathan
Near-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in