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Advanced Electronics Packaging Digest

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NEURA Robotics Announces Record Series C of up to $1.4 Billion

06/12/2026 | BUSINESS WIRE
NEURA Robotics, the pioneer in cognitive robotics and creator of the Neuraverse, announced a landmark Series C financing with a total round size of up to $1.4 billion to accelerate its mission of building the world’s leading Physical AI platform.

GlobalFoundries Completes Acquisition of Synopsys’ Processo

06/03/2026 | GlobalFoundries
GlobalFoundries announced the completion of its previously announced acquisition of Synopsys’ ARC Processor IP Solutions business.

FPGA AI Chip Market to Surpass $100M Shipments by 2031 Amid Rapid ASP Decline

05/07/2026 | JPR
Jon Peddie Research (JPR), the market research and consulting firm covering graphics, AI processors, and visual computing, released FPGAs in AI, a new market intelligence report analyzing the emerging class of field-programmable chips designed for AI inference at the edge and in the cloud, and for IoT.

Skoltech Team Develops Modulator for Compact Photonic Integrated Circuits

04/28/2026 | Skoltech
Researchers at Skoltech have developed an ultra-compact electro-optic modulator based on silicon photonics and plasmonics that enables high-efficiency optical signal control within a small device footprint.

Cadence, NVIDIA Expand AI & Accelerated Computing Partnership

04/17/2026 | Cadence Design Systems, Inc.
At CadenceLIVE Silicon Valley 2026, Cadence announced an expanded partnership with NVIDIA to deliver accelerated solutions across agentic AI, physics-based simulation and digital twins to unlock new levels of productivity and accelerate next‑generation engineering design flows across semiconductor design, physical AI systems and hyperscale AI factories.
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