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TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

09/27/2024 | ANSYS
Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.

Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration 

09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. Swaminathan
Near-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.

Infineon Opens the World’s Largest and Most Efficient SiC Power Semiconductor Fab in Malaysia

08/16/2024 | Infineon
As global decarbonization efforts drive demand for power semiconductors, Infineon Technologies AG  has officially opened the first phase of a new fab in Malaysia that will become the world’s largest and most competitive 200-millimeter silicon carbide (SiC) power semiconductor fab.

Natrion Selected for Phase I & Phase II Contracts by the US Air Force

08/14/2024 | PRNewswire
Solid-state battery component developer Natrion announced that it has been selected for two Small Business Innovation Research (SBIR) contracts from the US Air Force: a Phase I from Air Force Global Strike Command (AFGSC) and a Phase II from AFWERX, the Air Force's innovation arm.

Entegris Enters into Long-term Supply Agreement with onsemi

08/07/2024 | Entegris
Entegris, Inc. announced it has entered into a long-term supply agreement with onsemi, a leading manufacturer of advanced energy-efficient power semiconductors. Under the terms of the agreement, Entegris will provide onsemi a broad range of co-optimized chemical mechanical planarization (CMP) solutions for silicon carbide (SiC) applications.
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