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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
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Z-AXIS Will Double Its Surface Mount Capacity
June 21, 2024 | Z-AXISEstimated reading time: 1 minute
Z-AXIS, a fast-growing provider of electronic design and manufacturing services, will double its surface mount technology (SMT) capacity during Phase 1 of a $1.5M USD expansion. The electronics contract manufacturer ordered a total of 15 new pieces of equipment after visiting the IPC APEX 2024 tradeshow this spring.
“This is the first phase of three-phase expansion,” said Michael Allen, Z-AXIS’ President. “Expanding our surface mount capabilities will allow us to take on even more SMT jobs while accelerating production,” he added.
During the first phase of its latest expansion, Z-AXIS will replace its new product introduction (NPI) line with an SMT line that is effectively as fast as its other two high-speed lines combined. The company will retain the current NPI line’s oven but add a board dropper, stencil printer, conveyor, two pick-and-place machines, a board turner, another conveyor, and automated optical inspection (AOI) technology.
Z-AXIS selected the AOI equipment based on information gained at IPC APEX 2024, the electronics manufacturing industry’s largest event in North America. Z-AXIS expanded its wire and cable assembly production in 2020 and has a rich history investing in state-of-the-art equipment. The company’s current expansion is self-funded and reflects a record number of sales bookings this year.
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