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Z-AXIS Will Double Its Surface Mount Capacity
June 21, 2024 | Z-AXISEstimated reading time: 1 minute
Z-AXIS, a fast-growing provider of electronic design and manufacturing services, will double its surface mount technology (SMT) capacity during Phase 1 of a $1.5M USD expansion. The electronics contract manufacturer ordered a total of 15 new pieces of equipment after visiting the IPC APEX 2024 tradeshow this spring.
“This is the first phase of three-phase expansion,” said Michael Allen, Z-AXIS’ President. “Expanding our surface mount capabilities will allow us to take on even more SMT jobs while accelerating production,” he added.
During the first phase of its latest expansion, Z-AXIS will replace its new product introduction (NPI) line with an SMT line that is effectively as fast as its other two high-speed lines combined. The company will retain the current NPI line’s oven but add a board dropper, stencil printer, conveyor, two pick-and-place machines, a board turner, another conveyor, and automated optical inspection (AOI) technology.
Z-AXIS selected the AOI equipment based on information gained at IPC APEX 2024, the electronics manufacturing industry’s largest event in North America. Z-AXIS expanded its wire and cable assembly production in 2020 and has a rich history investing in state-of-the-art equipment. The company’s current expansion is self-funded and reflects a record number of sales bookings this year.
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I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
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AI Triggers Next Paradigm Shift in PDN
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