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Overview of Soldering Systems With Vacuum

12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbH
When soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.

Jabil and Cyferd Unveil ID8 Global, a Joint Venture Launching Groundbreaking AI-Driven, Fully Autonomous Supply Chain Platform

11/12/2024 | Jabil
Jabil Inc., a global leader in engineering, manufacturing, and supply chain solutions today announced ID8 Global, a joint venture with Cyferd Inc., a pioneering AI company specializing in data technology.

Ministry of Energy Announces Joint Venture to Advance Vision 2030 with Locally-made EV Chargers

11/04/2024 | Foxconn
Ministry of Energy has announced the formation of a groundbreaking joint venture between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology (FIT), a highly esteemed global manufacturer to support the Kingdom's Vision 2030.

RTX's Raytheon Continues to Demonstrate GhostEye MR Operational Readiness during U.S. Military Test Event

10/30/2024 | RTX
Raytheon, an RTX business, in partnership with the Office of the Secretary of Defense (OSD), the U.S. Air Force Research Laboratory Strategic Development Planning and Experimentation office, and the U.S. Navy, demonstrated the multi-mission GhostEye® MR advanced medium-range sensor during a joint test event called Gray Flag 2024. GhostEye MR tracked targets over water, showcasing the sensor's readiness to deter current and future threats.

AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum

10/18/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
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