The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
May 26, 2025 | ClassOne TechnologyEstimated reading time: Less than a minute
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging. The two companies will leverage their respective semiconductor chemistry expertise to create innovative solvent solutions for a range of advanced semiconductor and packaging process applications.
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices. NMP, or N-Methylpyrrolidone, is a chemical compound long used in a variety of industries, including semiconductor fabrication, for removal of surface materials.
ClassOne has been a strategic supplier to IBM since 2014, developing technologies in electroplating, metal lift-off (MLO) and wet cleaning processes, and subsequently expanding to advanced packaging applications.
ClassOne CEO Byron Exarcos noted, “This collaboration represents a significant step forward in developing alternatives for advanced semiconductor processing. Combining our flexible wafer-processing platform and seasoned team with IBM’s extensive research experience and resources will result in novel solutions that we look forward to sharing throughout our industry.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
NNME Debuts ChipPath as the Central Gateway for U.S. Semiconductor Careers, Featuring 90,000 Live Job Openings
10/24/2025 | SEMITo help meet the growing demand for skilled workers in the U.S. semiconductor and microelectronics industry, the National Network for Microelectronics Education (NNME), operated by the SEMI Foundation, announced the launch of ChipPath, a first-of-its-kind, AI-enabled career platform that connects individuals directly to real opportunities across the industry.
STMicroelectronics Reports Q3 2025 Financial Results
10/23/2025 | Globe NewswireSTMicroelectronics N.V. , a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the third quarter ended September 27, 2025.
Zhen Ding Highlights AI PCBs, IC Substrates at TPCA 2025
10/22/2025 | Zhen DingThe annual PCB industry event, TPCA Show 2025, kicked off on October 22 at the Nangang Exhibition Center. Zhen Ding Tech Group showcased a full range of high-end PCBs and IC substrates under the theme of artificial intelligence (AI).
SEMICON Japan 2025 to Spotlight Sustainability in AI and Semiconductor Innovation
10/22/2025 | SEMISEMICON Japan 2025, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will bring together more than 1,200 exhibitors showcasing semiconductor solutions from December 17-19 at Tokyo Big Sight.
Pixelworks Announces Definitive Purchase Agreement to Sell its Shanghai Semiconductor Subsidiary to VeriSilicon
10/16/2025 | PRNewswirePixelworks, Inc., a leading provider of innovative video and display processing solutions, today announced that it has signed a definitive agreement to sell its shares in Pixelworks Semiconductor Technology (Shanghai) Co., Ltd., a company organized under the laws of the People's Republic of China and a subsidiary of Pixelworks, to a special purpose entity led by VeriSilicon Microelectronics (Shanghai) Co., Ltd.