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Renesas UPDATE: Regarding Acquisition of Stock of Altium Limited
June 28, 2024 | RenesasEstimated reading time: Less than a minute
As announced in the press release “Regarding Acquisition of Stock of Altium Limited” issued on February 15, 2024, Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, entered into a Scheme Implementation Agreement for Renesas to acquire Altium Limited, a global leader in electronics design systems, by way of a Scheme of Arrangement under Australian law, pursuant to which Renesas will acquire all outstanding shares of Altium, making Altium an indirect wholly-owned subsidiary of Renesas, subject to satisfaction of certain conditions.
Upon closing and as a result of the Acquisition, Renesas will also indirectly acquire the following three companies as consolidated subsidiaries (specified subsidiaries) of Altium Limited: Altium IP Hold Co. Pty Limited, Altium IP Co. Pty Limited and Altium LLC. Detailed information of each of these subsidiaries was not available on February 15, 2024. However, Renesas has obtained the information and has therefore announced the updated information of the three companies as follows. The Acquisition is expected to be completed in the second half of 2024 following the approval by Altium shareholders, Australian court, and relevant regulatory authorities, as well as satisfaction of other customary closing conditions.
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09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.