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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/22/2026 | Nolan Johnson, I-Connect007
It’s been a busy week in the news. I could legitimately have published another five items because there were so many meaningful topics. So, I start with attorney James Kim, who returns to update us on metals tariffs. Brian Chislea and Cody Schoener from Dow recently published a book on UV curable conformal coatings. The Taiwan Printed Circuit Association has launched a PCB-specific AI knowledge base. SEMI FlexTech is seeking proposals for advancing flexible hybrid technologies, and the Global Electronics Association has launched the Global Electronics Policy Council, unifying its advocacy voices.

New Senate Bill Supports Reshoring and Restoring U.S. Printed Circuit Board Manufacturing

05/21/2026 | PCBAA
The Printed Circuit Board Association of America celebrates the introduction of a crucial bill that will pave the way to reshore and restore America’s printed circuit board (PCB) industry. Over the past 30 years U.S. share of the world supply of PCBs shrunk from 30 percent to 4 percent because of offshoring. Congress is offering legislative solutions to reverse this trend.

Global Electronics Association Launches Global Electronics Policy Council to Unite Industry on Trade, Investment, and Supply Chain Policy

05/20/2026 | Global Electronics Association
The Global Electronics Association announced the formation of the Global Electronics Policy Council (GEPC), a new body uniting leading electronics companies from around the world to advance a coordinated policy agenda across every major region of the electronics supply chain.

PCB East 2026: AI Infrastructure, Advanced PCB Technologies, and the Future of Electronics Manufacturing

05/19/2026 | Doug Dixon, 360Circuits
After attending PCB East 2026, it became clear to me that the electronics industry is entering a major transition driven by AI infrastructure, increasing power density, and growing system complexity, extending far beyond semiconductors alone. What stood out was how critical PCB technology, materials science, thermal management, and advanced manufacturing have become to the future of electronics. The industry is now facing many challenges, including tighter manufacturing tolerances, material shortages, rising costs, and growing pressure to digitally transform engineering and manufacturing operations.

Packet Digital Awarded $9.8M U.S. Navy Contract to Scale Battery Cell Production

05/18/2026 | Packet Digital
Packet Digital, and its subsidiary Badland Batteries, a U.S.-based leader in advanced lithium-ion battery technology for drones, unmanned aerial systems (UAS) and other defense applications, announced today that it has been awarded $9.8 million as it moves to Phase 3 of its U.S. Navy contract under the Logistics UAS Family of Advanced Batteries program.
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