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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations
July 8, 2024 | IPCEstimated reading time: Less than a minute
The IPC workshop on IPC-2951-CFX Future Factory Applications & Real Scene Demonstrations to be held August 23, 2024 | 1:00 - 5:00pm CST, will be organized during 2024 Taiwan Robot and Intelligent Automation Exhibition \ 2024 Taipei International Industrial Automation Exhibition from August 21-24, showcasing the research and experience on industry pain points:
- Introduction of IPC-HERMES-9852 & Basic Architecture & Transmission Mechanism & Interchangeable Messages
- Introduction of IPC-2951-CFX & Basic Architecture & Transmission Mechanism & Basic Specifications (Table 6-1, 6-2) & Interchangeable Messages & Application Scene Introduction & Factory of the Future Applications & Real Scene Demonstrations
- AMR Automated Loading and Unloading (CFX)
- First Station Data & Batch Completion Data & Rework Station PCB Placement & Command Stop Board
- Integration System Manufacturer – Enlight Technology for CFX Equipment Integration
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Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.
NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
04/28/2025 | PRNewswireNEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions.
OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment
04/28/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
ITRI Named a Top 100 Global Innovator for the Ninth Time
04/28/2025 | PRNewswireThe Industrial Technology Research Institute (ITRI) was officially honored at the 2025 Top 100 Global Innovators Award Ceremony hosted by Clarivate in Taipei.
Airbus Signs Definitive Agreement with Spirit AeroSystems
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