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Teledyne Appoints George Bobb as Chief Executive Officer

05/01/2025 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne’s Board of Directors named George C. Bobb III as Teledyne’s President and Chief Executive Officer, effective immediately. Simultaneously, Edwin Roks has retired as Teledyne’s Chief Executive Officer, but will continue as a special advisor to Robert Mehrabian, Executive Chairman, through August 31, 2025.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week 

07/12/2024 | Marcy LaRont, PCB007 Magazine
I spent my week at SEMICON West in San Francisco, returning last night. It was a full week that had me drawing parallels between what is happening in the semiconductor sector and in our segment of the supply chain. I had my mind blown listening to presentations and panels on things like quantum computing. The future is indeed bright. Tech-heavy, but very bright. If there was one phrase from the conference that rings most true in my mind, it is “unprecedented opportunities and unprecedented challenges.” Stay tuned for SEMICON coverage over the next week and additional coverage in our August magazines. 

I-Connect007 Columnist George Milad Passes Away

12/20/2023 | I-Connect007 Editorial Team
I-Connect007 columnist George Milad passed away on Dec. 7, 2023, at the age of 81. George was well-known in the PCB industry for his technical expertise in physical organic chemistry. He was employed as a national accounts manager at Uyemura International Corporation, was the author of the chapters on plating and surface finishing in Printed Circuit Handbook: Seventh Edition, and had a series of publications on electrolytic plating and metallic surface finishes.

Major U.S. Holiday Today: Independence Day

07/04/2022 | I-Connect007 Editorial Team
Today marks the 246th Independence Day of the United States of America. It is a national holiday.

Gowanda Expanding its DYCO Electronics Facility

11/11/2020 | Gowanda Components Group
Gowanda Components Group is pleased to announce the completion of a nearly 50% expansion at its DYCO Electronics facility in Hornell, New York. The 12,000 sq. ft. expansion will help the company address market demand for its products, enhance work flow and improve operational efficiency.
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