Dan's Biz Bookshelf: 'Move Your Bus'
Driving Innovation: Direct Imaging vs. Conventional Exposure
It’s Only Common Sense: Selling to Today's Generation of Buyers
EV Group’s EVG 880 LayerRelease System Wins 2024 Best of West Award
July 15, 2024 | SEMIEstimated reading time: 1 minute
The EVG®880 LayerRelease™ system from EV Group (EVG) has won the 2024 Best of West award, SEMI and Semiconductor Digest announced at SEMICON West 2024 at the Moscone Center in San Francisco. Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
The EVG®880 LayerRelease™ system is the first high volume manufacturing (HVM) equipment platform incorporating EVG’s innovative LayerRelease™ technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials. As a result, it eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps.
“The EVG 880 LayerRelease system enables an important step forward for 3D integration,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. By enabling 3D stacking of ultra-thin layers, the EVG880 LayerRelease system allows for shorter distances between stacked dies, which in turn allows faster data exchange from one die to another while reducing power consumption. “Congratulations to EV Group for again winning the Best of West competition.” The company previously won for its LITHOSCALE Maskless Exposure System in 2021.
EV GroupEV Group is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
Share on:
Suggested Items
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Accenture Acquires SYSTEMA to Drive Manufacturing Automation for Semiconductor Clients
07/02/2025 | AccentureAccenture has acquired SYSTEMA, a provider of software solutions and consulting services for manufacturing automation, headquartered in Dresden, Germany.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.