-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
EV Group’s EVG 880 LayerRelease System Wins 2024 Best of West Award
July 15, 2024 | SEMIEstimated reading time: 1 minute
The EVG®880 LayerRelease™ system from EV Group (EVG) has won the 2024 Best of West award, SEMI and Semiconductor Digest announced at SEMICON West 2024 at the Moscone Center in San Francisco. Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
The EVG®880 LayerRelease™ system is the first high volume manufacturing (HVM) equipment platform incorporating EVG’s innovative LayerRelease™ technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials. As a result, it eliminates the need for glass carriers—enabling ultra-thin chiplet stacking for advanced packaging, as well as ultra-thin 3D layer stacking for front-end processing, including advanced logic, memory and power device formation, to support future 3D integration roadmaps.
“The EVG 880 LayerRelease system enables an important step forward for 3D integration,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. By enabling 3D stacking of ultra-thin layers, the EVG880 LayerRelease system allows for shorter distances between stacked dies, which in turn allows faster data exchange from one die to another while reducing power consumption. “Congratulations to EV Group for again winning the Best of West competition.” The company previously won for its LITHOSCALE Maskless Exposure System in 2021.
EV GroupEV Group is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
Suggested Items
The Indoor Lab Partners with MARTAC Tactical Systems
05/20/2025 | BUSINESS WIREThe Indoor Lab, a leader in LiDAR-based perception and real-time operational intelligence, announced a strategic partnership with MARTAC Tactical Systems, the premier developer of Unmanned Surface Vehicles.
AV’s Tomahawk Awarded $5.1M Contract for Human-Machine Integrated Formations Project by U.S. Army RCCTO
05/20/2025 | BUSINESS WIRETomahawk GCS, an AeroVironment (“AV”) product line specializing in autonomous and intelligent multi-domain systems, has been awarded a $5.1 million contract to support the U.S. Army Rapid Capabilities and Critical Technologies Office (RCCTO) Human-Machine Integrated Formations (HMIF) rapid prototyping project.
FocalPoint Announces Strategic Collaboration with STMicroelectronics to Deliver an Enhanced GNSS Solution for Automotive
05/20/2025 | PRNewswireFocalPoint, a UK-based software company providing next-gen positioning solutions for automotive, wearables and smartphones, has announced a strategic collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications.
Sanmina Announces Acquisition of Data Center Infrastructure Manufacturing Business of ZT Systems from AMD
05/19/2025 | PRNewswireSanmina Corporation, a leading integrated manufacturing solutions company, announced that it has entered into a definitive agreement to acquire the data center infrastructure manufacturing business of ZT Systems, a leading provider of Cloud and AI infrastructure to the world's largest hyperscalers, from AMD.
AI Helps Build Smarter, More Resilient Power Grids
05/16/2025 | BUSINESS WIREAs society’s reliance on electricity deepens, artificial intelligence (AI) is reshaping how we manage power grids and optimize energy sources.