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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Elementary, Mr. Watson: The Empty Chair—The Greatest Fear in PCB Design

11/03/2026 | John Watson -- Column: Elementary, Mr. Watson
I stopped in the hallway, staring into the room at the end of the hall with the lone empty chair, trying to remember how I got here. The fear from the rooms I had already passed through was still fresh in my mind. Each one had revealed another challenge that every PCB designer eventually faces.

Cadence InnoStack AI Agent Supports Socionext’s 3nm SoC Design

10/21/2026 | Cadence Design Systems
 Socionext Inc., a global leader in custom SoC design and development, is actively advancing its SoC design and development capabilities through agentic AI and expanding the application of AI-driven design to the physical design of large-scale system-on-chip (SoCs) using advanced process technologies.

Who Will Replace Electronics Manufacturing’s Most Experienced Workers?

10/20/2026 | I-Connect007
The electronics manufacturing industry has spent years discussing technological advancement, expanding domestic production, and developing the next generation of manufacturing capabilities. But behind those conversations is another challenge that deserves attention: Who will replace the industry’s most experienced workers as they approach retirement? Recent research from the U.S. Census Bureau illustrates the scale of the issue. In 2022, 52.1% of workers in electronic component and product manufacturing were age 45 or older.

SMTA 'Members of Distinction' Awards Announced

09/21/2026 | SMTA
The SMTA is proud to honor the 2026 “Members of Distinction” award recipients who have shown exceptional dedication to the association and the electronics manufacturing industry.

STARTEAM GLOBAL Joins IPAI to Advance AI Innovation in PCB Manufacturing

09/16/2026 | STARTEAM GLOBAL
We are pleased to announce that STARTEAM GLOBAL has joined IPAI (Innovation Park Artificial Intelligence), one of Europe’s leading AI innovation hubs dedicated to accelerating the practical application of AI across industries.
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