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Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.

SIA Applauds CHIPS Incentives for Hemlock Manufacturing Expansion in Michigan

10/22/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Hemlock Semiconductor (HSC).

SIA Applauds CHIPS Act Incentives for Wolfspeed Manufacturing in North Carolina and New York

10/16/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Wolfspeed.

Iridium to Collaborate with Nordic Semiconductor on Iridium NTN Direct integration

10/11/2024 | PRNewswire
Iridium Communications Inc., a leading provider of global voice and data satellite communications, announced its collaboration with Nordic Semiconductor for early integration of its Iridium NTN Direct℠ service into Nordic's LTE-M/NB-IoT modules and chipsets.

CHIPS Act Falls Short Without Focus on Workforce Training

10/02/2024 | David Hernandez, VP of Education, IPC
Billions of dollars of funding from the CHIPS and Science Act are going to the construction of new semiconductor fabrication plants (“fabs”). However, that investment will fail to meet its full potential unless we also focus on building something equally important: talent pipelines for the entire electronics manufacturing ecosystem. 
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