The Knowledge Base: A Conference for Cleaning and Coating of Mission-critical Electronics
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
BAE Systems to Deliver Advanced Microelectronics to U.S. Defense Industrial Base
July 23, 2024 | BUSINESS WIREEstimated reading time: 1 minute
The Office of the Undersecretary of Defense for Research & Engineering’s Trusted & Assured Microelectronics program through Naval Surface Warfare Center (NSWC) Crane Division’s Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) Other Transaction Agreement (OTA) vehicle has awarded BAE Systems’ FAST Labs™ Research and Development organization a $22 million contract. The contract will support the Strategic Transition of Microelectronics to Accelerate Modernization by Prototyping and Innovating in the Packaging Ecosystem (STEAM PIPE) project and will be managed by National Security Technology Accelerator (NSTXL).
Microelectronics play a critical role in furthering the Department of Defense’s warfighting capabilities. BAE Systems’ work under the STEAM PIPE project will result in the development and delivery of advanced chiplet prototypes that will transition into military systems. The technology will be made available to the entire U.S. defense industrial base.
“The highly specialized chiplets are small, modular pieces that can be combined to form a larger, more complex system-on-a-chip,” said Wes Allen, director of Microelectronics at BAE Systems’ FAST Labs. “This is the beginning of a new chiplet ecosystem that could result in breakthroughs like enabling smaller form factor electronic warfare technology on new platforms.”
Work on the project, which builds on the technology advances of recent programs and follows a recently announced delivery milestone on the State-of-the-Art Heterogeneous Integrated Packaging (SHIP) program, includes collaboration with subcontractors Extoll GmbH and Comcores ApS.
Share on:
Suggested Items
OSI Systems Receives $34 Million Contract for Cargo and Vehicle Inspection Systems
07/11/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division has been awarded a contract worth approximately $34 million by an international customer.
OSI Systems Lands $17 Million Order for Cargo and Vehicle Inspection Systems
07/07/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received an order valued at approximately $17 million from an international customer for cargo and vehicle inspection systems.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
IBM, RIKEN Unveil First IBM Quantum System Two Outside of the U.S.
06/24/2025 | IBMIBM and RIKEN, a national research laboratory in Japan, today unveiled the first IBM Quantum System Two ever to be deployed outside of the United States and beyond an IBM Quantum Data Center.