Strip Etch Strip: Episode 9 of On the Line With... Designing for Reality Podcast Now Available
July 25, 2024 | I-Connect007Estimated reading time: Less than a minute
Don't miss the latest episode of "On the Line With... Designing for Reality," where we walk through the PCB manufacturing process. At this stage, we have a panel made up of all the internal layers laminated together, through-holes drilled, and the outer layer copper features covered with a protective layer of tin. Join us as ASC Sunstone’s VP Matt Stevenson guides us through the process sequence for outer layer strip, etch, and strip.
This series offers specific insights that can impact circuit board manufacturing, providing tips and tricks for optimizing design, fabrication, yields, and cost.
I-Connect007 is committed to delivering digital content that meets the needs of the electronics industry, including magazines, books, newsletters, market reports, podcasts, and event coverage. As the industry's longest-running digital media company, I-Connect007 is a leading publisher of original content for the global electronics industry.
Visit our educational resource center to access more free content.
Suggested Items
Revolutionizing Inner Layer Registration
12/26/2024 | Marcy LaRont, I-Connect007In this interview with Anthony (Tony) Faraci, founder and president of DIS, we delve into enhancing inner layer accuracy and yields, pivotal to boosting profitability in the circuit board industry. Tony has extensive experience in the development of tooling technology over the decades, which ultimately led to his founding DIS. From his beginnings at Multiline to tackling the challenges of registration accuracy, Tony's insights clearly lay out the complexities of modern manufacturing and the innovations in shaping the future of inner layer registration.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Dicro Accepted as a Member of the Defence and Aerospace Industry Association PIA
12/18/2024 | Dicro OyDicro is proud to announce that the company has been accepted as a member of the Defence and Aerospace Industry Association PIA, starting from January 1, 2025. This membership reinforces Dicro's commitment to high-quality and innovative solutions in the defence and aerospace sectors.
Marcy’s Musings: Boosting Your Inner Layer Precision and Production Outcomes
12/17/2024 | Marcy LaRont -- Column: Marcy's MusingsIf you went to college, it’s likely you did so because your parents told you that getting your education would provide a firm foundation to build a successful career. But attending college is not the end-all, be-all of creating a successful career, especially in our industry which offers many great opportunities that do not require that kind of higher education. Of course, you can’t argue that education and training provide a solid foundation upon which to build and lead to eventual success in an undertaking.
Inner Layer Precision & Yields Explored in December 2024 Issue of PCB007 Magazine
12/16/2024 | I-Connect007 Editorial TeamBuilding accuracy into your inner layers as well as being able to assess their pass/fail status as early as possible is critical. In this month’s PCB007 Magazine, we take a close look at building precision into your inner layers.