Winners of the IPC Hand Soldering and Rework Competition Malaysia at Electronics Manufacturing Expo Asia (EMAX) 2024 Announced
July 29, 2024 | IPCEstimated reading time: 1 minute
In conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.
Skilled contestants competed against each other to rework a functional electronics assembly within a 50-minute time limit. Assemblies were judged on soldering in accordance with IPC-A-610H, IPC J-STD-001H, IPC-7711/21C - Class 3 criteria, the speed at which the assembly was produced, and overall electrical functionality of the assembly.
On the winner’s podium at EMAX 2024 were:
- First Place: Pubalan Sivasangkar, Cytron Technologies Sdn Bhd. As the winner, Sivasangkar qualified for the IPC Hand Soldering World Championship in Germany in November 2024.
- The top two runners-up came from the same company, Jabil Circuit Sdn Bhd. Second place this year went to Hasrol Mizam Bin Hassan. Norishah Binti Othman took third place.
IPC would like to thank Hand Soldering and Rework Competition sponsors and partners for their generous support this year.
- Premier Sponsor: JBC
- Gold Sponsor: SOLDERINDO
- Supporting Sponsor: BTE
- Co-Organizer: NRG Exhibitions
For more information on upcoming hand soldering and rework competitions, contact Henry Ton, senior business development manager, Southeast Asia, at HenryTon@ipc.org.
Suggested Items
Infineon Beats Fiscal Year Start Expectations, Raises Outlook on Currency Effects
02/04/2025 | InfineonInfineon Technologies AG is reporting results for the first quarter of the 2025 fiscal year (period ended 31 December 2024).
Swissbit Unveils PCIe Gen4 SSD A1200
02/04/2025 | SwissbitSwissbit introduces the latest addition to its PCIe portfolio, the new A1200. The PCIe Gen4 M.2 SSD is designed to meet the demands of high-performance, mission-critical applications, focusing on consistent performance, low latency, and data integrity.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Building on DesignCon’s 30th Anniversary Momentum
02/04/2025 | Marcy LaRont, I-Connect007With three decades of technological advancements, DesignCon has established itself as a premier conference for electronics design. Susan Deffree, the group event coordinator, reflects on the event's rich history and the exciting developments for its 30th anniversary.
Creative Materials Releases New Solvent-Based Urethane Conformal Coating
02/03/2025 | Creative Materials, Inc.Creative Materials Inc., a leading innovator in specialty coatings, is proud to announce product: 111-27, a high dielectric strength solvent-based one-component urethane conformal coating designed to offer outstanding long-term performance in demanding environments primarily in the aerospace and defense field.