Driving Innovation: Inner Layer Alignment Methods in PCB Production
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
It’s Only Common Sense: Sales as a Team Sport
IPC Releases Latest Standards and Revisions Updates
June 5, 2025 | IPCEstimated reading time: 1 minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2 2025.
IPC-1602A
Standard for Printed Board Handling and Storage
The industry's sole standard on the handling, packaging, and storage of printed boards. The requirements in this document are intended to protect printed boards from contamination, physical damage, solderability degradation, ESD, and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling, and transport of product, as well as establishing baking profiles for moisture removal. This document addresses the impact of baking on printed board solderability, moisture concerns for etched cores and composites, dry packaging requirements including moisture barrier bags (MBBs), desiccant material and HIC cards, test coupons for evaluating relative moisture absorption and guidance for floor life and rework by baking.
IPC-7095E
Design and Assembly Process Guidance for Ball Grid Arrays (BGAs)
IPC-7095E describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair, and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095E provides valuable and practical information to those who use or are considering using BGAs. IPC-7095E provides descriptions of how to successfully implement robust design and assembly processes for printed board assemblies using BGAs, as well as ways to troubleshoot some common anomalies that can occur during BGA assembly.
IPC-8401
Guidelines for In-Mold Electronics
IPC-8401 provides guidelines for in-mold electronics (IME) manufacturing processes, part structures, candidate materials, and production test methods. In-mold electronics integrate printed electronics and electrical components into injection-molded plastics, creating a three-dimensional smart molded structure. IME technology uses mass production processes, materials, and components. IME parts are structural electronics characterized by their light weight, thinness, robustness, and seamless integration.
Get the rest of the updates in the Spring 2025 issue of IPC Community.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Zhen Ding Posts July 2025 Monthly Revenue Report
08/07/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported July 2025 revenue of NT$13,352 million, down 0.79% YoY and up 4.13% MoM.
Exception PCB Acquisition Strengthens UK Manufacturing Resilience
08/07/2025 | Wright IndustriesWright Industries announced it has acquired Exception PCB Ltd, returning the Printed Circuit Board (PCB) manufacturer to UK ownership.
Summer Vacation at AT&S: Welcome to World of Experience
08/06/2025 | AT&SWelcome to the cool world of microelectronics. At AT&S, high-quality IC substrates and printed circuit boards are produced for prominent customers from the high-tech world, which have essential functions in smartphones, smartwatches and laptops and are also indispensable in airplanes, electric cars, satellites and many applications of digital life.
Ventec International Group Announces Distribution Agreement with Jinzhou Precision Technology Corporation
08/05/2025 | VentecVentec International Group has confirmed its agreement with Jinzhou Precision Technology Corporation to distribute precision drill and router bits in the Europe, Middle East, and Africa (EMEA) region, working in cooperation with DCM Technology, Jinzhou’s long standing European distribution partner.
Rogers Reports Q2 2025 Results; Net Sales Up 6.5%
08/04/2025 | Rogers CorporationNet sales of $202.8 million increased 6.5% versus the prior quarter. Advanced Electronics Solutions (AES) net sales increased by 4.6% primarily related to higher industrial, ADAS and aerospace and defense (A&D) sales, partially offset by lower wireless infrastructure sales.