It’s Only Common Sense: Your Biggest Competitor Is Complacency
The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
Marcy’s Musings: The Legislative Outlook—Helping or Hurting?
ASMPT Makes High-strength and High-conductivity Joints Possible with Silver Sintering
July 30, 2024 | ASMPTEstimated reading time: 1 minute
ASMPT, the world’s leading provider of hardware and software for semiconductor and electronics production, presents an innovative die and module bonding platform that can be used in a variety of ways for producing power modules.
“Whether for electromobility, renewable energies or industrial automation and motor control systems – in the course of the energy transition, electricity is increasingly becoming the dominant energy source,” explains David Felicetti, Business Development & Product Marketing Manager, at ASMPT. “But especially in power electronics, conventional joining technologies such as soft soldering are increasingly reaching their limits.”
Silver sintering instead of soldering
ASMPT has overcome these limitations with its line of products for silver sintering and, in future applications, copper sintering. POWER VECTOR, for pick and place or tacking dies and modules on heat sinks, completes the process chain in ASMPT's sintering production line.
The advantages of this process are obvious: While silver has a melting point of 961 degrees Celsius, it can be “cemented” at much lower temperatures when pressure is applied, resulting is a thermally and mechanically strong connection with excellent conductivity.
Process and feeding flexibility
With the POWER VECTOR, this method is now being translated into a practice-oriented manufacturing system. The platform features an automatic tool changer, achieves bonding forces of up to 588 N, and works with all popular processes: dry paste, wet paste, and die transfer film (DTF). Components can be supplied via wafer, tape-and-reel, waffle pack, or tray.
The POWER VECTOR uses a hot thermo-compression bond head to place dies on the substrate with outstanding precision. To achieve this, the bond head and platform can be heated to >200°C to create a pre-adhesion, which is finished using ASMPT's SilverSAM sintering platform at temperatures between 200 and 300 degrees Celsius and pressures between 5 and 30 MPa.
“Silver sintering creates reliable and highly conductive connections even in applications with high currents where components become quite hot,” says David Felicetti. “With the POWER VECTOR system, we have closed one of the last remaining gaps in our portfolio and are now able to offer a full-service production line for power modules.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Infineon to Purchase Long-Term Green Electricity from Wind Farms in Brandenburg, Germany and Solar Plants in Spain
10/27/2025 | InfineonInfineon Technologies AG has concluded Power Purchase Agreements (PPA) with PNE AG and Statkraft for green electricity.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/24/2025 | Andy Shaughnessy, I-Connect007This week, we have quite a bit of international content in this week’s list of must-reads. Nothing happens in a vacuum, including electronics manufacturing and design, and this has been quite an eventful year. How many of us are now tariff experts? I’m certainly not, but that hasn’t stopped me from opining about the situation.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
PDN Optimization: Balancing Performance and Cost in SoC Designs
10/22/2025 | Zach Caprai. Siemens EDAThis article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.
Beyond Design: The Fundamental Structure of Spectral Integrity
10/21/2025 | Barry Olney -- Column: Beyond DesignImpedance can be characterized in both the time and frequency domains. In the time domain, it influences how electromagnetic energy propagates through interconnects, affecting signal integrity and waveform fidelity. In the frequency domain, AC impedance determines how well the network can suppress noise and deliver clean power at a range of frequencies. AC impedance shapes how power rails respond to transient loads.