SIA Applauds House Introduction of Legislation to Establish Investment Tax Credit for Semiconductor Design
July 31, 2024 | SIAEstimated reading time: 1 minute

The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of bipartisan legislation that would expand the CHIPS and Science Act’s 25% investment tax credit to include investments in semiconductor design, the critical and high-value-add mapping of a chip’s intricate circuitry. The Semiconductor Technology Advancement and Research (STAR) Act was introduced today by Reps. Blake Moore (R-UT), Michael McCaul (R-TX), Doris Matsui (D-CA.), Suzan DelBene (D-WA), John Moolenaar (R-MI), Raja Krishnamoorthi (D-IL), Ro Khanna (D-CA), Joe Morelle (D-NY), and Claudia Tenney (R-NY).
“For America to lead the world in semiconductor innovation, it must continue to lead in chip design. The STAR Act will help promote this critical part of the semiconductor ecosystem and strengthen America’s economy, national security, and technology leadership. We applaud Reps. Moore, McCaul, Matsui, DelBene, Moolenaar, Khanna, Morelle, and Tenney for introducing this much-needed legislation and urge Congress to approve it.”
The United States has long been the leader in semiconductor design, which has enabled the U.S. to foster key innovations across the digital economy in areas such as artificial intelligence, 5G communications, robotics, healthcare, and autonomous vehicles. The U.S. has built-in advantages in chip design, including being home to the world’s best universities and a highly skilled workforce. Global competition in chip design is increasing, however, as other countries actively support the development of their own design sectors.
Global competitors are investing in chip design, while the U.S. lacks direct incentives for semiconductor design, thereby placing U.S. leadership at risk. A November 2022 report by SIA and the Boston Consulting Group found incentives for semiconductor design and R&D would help maintain long-term U.S. chip design leadership. Such an investment would fortify the U.S. design ecosystem, support training and employment for more than 150,000 jobs across the economy, and help the U.S. win the global competition for key semiconductor-dependent innovations of the future, according to the report.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).