SIA Applauds House Introduction of Legislation to Establish Investment Tax Credit for Semiconductor Design
July 31, 2024 | SIAEstimated reading time: 1 minute

The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of bipartisan legislation that would expand the CHIPS and Science Act’s 25% investment tax credit to include investments in semiconductor design, the critical and high-value-add mapping of a chip’s intricate circuitry. The Semiconductor Technology Advancement and Research (STAR) Act was introduced today by Reps. Blake Moore (R-UT), Michael McCaul (R-TX), Doris Matsui (D-CA.), Suzan DelBene (D-WA), John Moolenaar (R-MI), Raja Krishnamoorthi (D-IL), Ro Khanna (D-CA), Joe Morelle (D-NY), and Claudia Tenney (R-NY).
“For America to lead the world in semiconductor innovation, it must continue to lead in chip design. The STAR Act will help promote this critical part of the semiconductor ecosystem and strengthen America’s economy, national security, and technology leadership. We applaud Reps. Moore, McCaul, Matsui, DelBene, Moolenaar, Khanna, Morelle, and Tenney for introducing this much-needed legislation and urge Congress to approve it.”
The United States has long been the leader in semiconductor design, which has enabled the U.S. to foster key innovations across the digital economy in areas such as artificial intelligence, 5G communications, robotics, healthcare, and autonomous vehicles. The U.S. has built-in advantages in chip design, including being home to the world’s best universities and a highly skilled workforce. Global competition in chip design is increasing, however, as other countries actively support the development of their own design sectors.
Global competitors are investing in chip design, while the U.S. lacks direct incentives for semiconductor design, thereby placing U.S. leadership at risk. A November 2022 report by SIA and the Boston Consulting Group found incentives for semiconductor design and R&D would help maintain long-term U.S. chip design leadership. Such an investment would fortify the U.S. design ecosystem, support training and employment for more than 150,000 jobs across the economy, and help the U.S. win the global competition for key semiconductor-dependent innovations of the future, according to the report.
Suggested Items
Siemens, TSMC Extend Collaboration to Drive Semiconductor Design Innovation
04/25/2025 | SiemensSiemens Digital Industries Software announced that the company has deepened longstanding collaboration with TSMC to drive innovation in semiconductor design and integration, enabling mutual customers to tackle the challenges of next-generation technologies.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Autodesk Donates $4.3 Million to Cornell University to Prepare students for an AI-powered future
04/24/2025 |Autodesk announced a $4.3 million gift to Cornell University’s College of Engineering and College of Architecture, Art, and Planning (AAP) to help prepare students for the future of work in an increasingly AI-driven world. The investment will fund a new Autodesk Cornell Engineering Design and Make Space in Upson Hall.
Driving Sustainability in PCB Design
04/24/2025 | Marcy LaRont, I-Connect007Filbert (Fil) Arzola is an electrical engineer at Raytheon. He’s smart, entertaining, and passionate about PCB design. As it turns out, he’s also passionate about “Mother Earth,” as he calls her. Born and raised in Southern California, he freely admits that he turns the water off when he brushes his teeth and yells at his brother for throwing batteries in the garbage. But when looking at the issue of sustainability and PCB design, he urges his audiences to ponder what sustainability looks like. Can PCB designers, he asks, make any impact on sustainability at all?
Real Time with... IPC APEX EXPO: Silicon Geometry's Signal Integrity Impact on PCBs
04/24/2025 | Marcy LaRont, I-Connect007At IPC APEX EXPO 2025, Kris Moyer addressed the importance of understanding the impact of silicon geometry reduction on signal integrity and PCB performance. Kris says signal integrity considerations are necessary for so many designs today, regardless of clock frequency. He discusses valuable insights from attendees regarding embedded resistor technology and the effects of radiation on smaller silicon features in aerospace applications.