-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
In-mold Electronics: The Convergence of Innovative Materials and Manufacturing Techniques
August 7, 2024 | Linda Stepanich, IPCEstimated reading time: 1 minute

Paavo Niskala, a noted expert in in-mold electronics (IME) at TactoTek, recognized the need for an industry-wide standard when one of his automotive OEM clients asked him how to test a prototype TactoTek had developed. That question led to the creation of the first-ever IPC standard of this type, IPC-8401, Guidelines for In-Mold Electronics, to be released later this year.
“When the customer asked me how to test the part, which is a combination of mechanics and electronics, I realized that a standard for IME does not exist, and that sparked the idea that we should do something,” Paavo says. “Later on, the French plastronics network had the same idea. Our proposal and the French proposal led to the formation of the IPC 3D Plastronics Steering Group. Our first face-to-face meeting was in Lyon, France, in April 2022.”
IME technology merges printed electronics, surface mount (SMT) components, and injection molding using mass-production processes, materials, and components. IME parts are structural electronics characterized by their lightweight, seamless integration. This technology appeals to industries such as automotive or aerospace because it reliably enhances the functionality of surfaces in illuminating spaces, such as door panels, center consoles, and front grill emblems. Combining printed electronics, SMT components, and injection molding is an ideal option for mass production due to the simplicity of both processes.
The automotive industry has driven the development of IME because it significantly reduces the cost, weight, waste, and energy required to produce vehicle interior parts. Rather than using a PCB in a plastic molding with features interacting with PCB sensors, IME components are integrated directly into the plastic molding, making the manufacturing process more streamlined, sustainable, and efficient.
“There's a big market pool for IME, especially in the automotive industry, which is looking for sustainable smart structures,” Paavo says of the new technology's appeal. “They want to build lighting on a 3D surface within the vehicle, whether it's an interior or exterior application. For example, automobiles are full of plastic parts. With IME technology, you can make those thin plastic parts smart and build a lighting application you cannot build with conventional electronics.”
To learn more about the standards being developed for in-mold electronics, read the rest of this article in the Summer 2024 issue of IPC Community.
Suggested Items
Critical Manufacturing Named as a Representative Vendor in 2025 Gartner® Market Guide for MES
06/17/2025 | Critical ManufacturingCritical Manufacturing, a leader in advanced Manufacturing Execution Systems (MES) and a subsidiary of ASMPT, has been recognized as a Representative Vendor in the May 2025 Gartner Market Guide for MES report.
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
06/17/2025 | Shane Whiteside -- Column: American Made AdvocacyWith the addition of RTX to PCBAA’s membership roster, we now represent the interests of companies in the entire PCB ecosystem. From material providers to OEMs, the insights of our collective members help us educate, advocate, and support legislation and policy favorable to America’s microelectronics manufacturers. The industry veterans who lead these companies provide valuable perspective, and their accumulated wisdom makes us an even stronger association.
BEST Inc Mobile Training Center Offers Unique Traveling Solder Training Classroom
06/16/2025 | BEST Inc.BEST Inc., a leader in electronic component services, training, and products is pleased to announce its Mobile Training Center (MTC) that stands out as the sole traveling solder training classroom across the United States.
Essemtec Welcomes Jacky Zhou as Country Sales Manager for China
06/16/2025 | EssemtecEssemtec is pleased to announce that Jacky Zhou has joined the company as Country Sales Manager for China, effective immediately. With more than two decades of experience in technical applications, sales development, and operational management, Jacky brings a wealth of expertise to further strengthen Essemtec’s presence in this strategically important market.
Takeaways from the Keynotes at the Edinburgh EIPC Summer Conference
06/16/2025 | Pete Starkey, I-Connect007It was seasonably wet and windy in Edinburgh, Scotland, June 3-4, where delegates from 17 countries convened for the 2025 EIPC Summer Conference to enjoy a superlative program of 18 technical presentations over two days, plus an excursion to a whisky distillery. EIPC President Alun Morgan welcomed everyone to the Delta Hotel, reminding us that in its previous iteration, it was the Royal Scot, traditionally the annual venue of the Institute of Circuit Technology Northern Symposium.