-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
In-mold Electronics: The Convergence of Innovative Materials and Manufacturing Techniques
August 7, 2024 | Linda Stepanich, IPCEstimated reading time: 1 minute

Paavo Niskala, a noted expert in in-mold electronics (IME) at TactoTek, recognized the need for an industry-wide standard when one of his automotive OEM clients asked him how to test a prototype TactoTek had developed. That question led to the creation of the first-ever IPC standard of this type, IPC-8401, Guidelines for In-Mold Electronics, to be released later this year.
“When the customer asked me how to test the part, which is a combination of mechanics and electronics, I realized that a standard for IME does not exist, and that sparked the idea that we should do something,” Paavo says. “Later on, the French plastronics network had the same idea. Our proposal and the French proposal led to the formation of the IPC 3D Plastronics Steering Group. Our first face-to-face meeting was in Lyon, France, in April 2022.”
IME technology merges printed electronics, surface mount (SMT) components, and injection molding using mass-production processes, materials, and components. IME parts are structural electronics characterized by their lightweight, seamless integration. This technology appeals to industries such as automotive or aerospace because it reliably enhances the functionality of surfaces in illuminating spaces, such as door panels, center consoles, and front grill emblems. Combining printed electronics, SMT components, and injection molding is an ideal option for mass production due to the simplicity of both processes.
The automotive industry has driven the development of IME because it significantly reduces the cost, weight, waste, and energy required to produce vehicle interior parts. Rather than using a PCB in a plastic molding with features interacting with PCB sensors, IME components are integrated directly into the plastic molding, making the manufacturing process more streamlined, sustainable, and efficient.
“There's a big market pool for IME, especially in the automotive industry, which is looking for sustainable smart structures,” Paavo says of the new technology's appeal. “They want to build lighting on a 3D surface within the vehicle, whether it's an interior or exterior application. For example, automobiles are full of plastic parts. With IME technology, you can make those thin plastic parts smart and build a lighting application you cannot build with conventional electronics.”
To learn more about the standards being developed for in-mold electronics, read the rest of this article in the Summer 2024 issue of IPC Community.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
LITEON Technology Reports Consolidated August Sales of NT$15.6 Billion, Up 13% M-o-M, 30% YoY
09/10/2025 | LITEON TechnologyLITEON Technology reported its August consolidated revenue of NT$15.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 13% M-o-M, 30% Y-o-Y.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Ynvisible Celebrates Inauguration of New Production Facility in Norrköping, Sweden
09/09/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a pioneer in sustainable and scalable e-paper display technology and printed electronics, is pleased to announce the successful inauguration of its new roll-to-roll production facility in Norrköping, Sweden – a city globally recognized as a center of excellence for Printed and Organic Electronics.
Sypris Wins Contract for Classified Missile Avionics Program
09/09/2025 | Sypris Solutions Inc.Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on contract award to manufacture and test advanced electronic power supply modules for integration into the avionics suite of a classified, mission-critical missile program. Production is scheduled to begin in 2026.