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Advanced Electronics Packaging Digest

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Suggested Items

Global Electronics Association Releases IPC-A-630A for Electronic Box Assemblies

07/29/2026 | Global Electronics Association
Updated standard provides class-coded acceptance criteria for box build and electromechanical assembly, from enclosure fabrication to final system testing.

Punching Out: M&A Deals in North American PCB and EMS Sectors for the First Half of 2026

07/30/2026 | Tom Kastner -- Column: Punching Out!
Mergers and acquisitions deals in the EMS and PCB sectors in North America in the first half of 2026 were pretty slow for a while, and then, boom, a bunch of deals were announced in May and June, and even more in July. In fact, I hadn’t heard of one deal in the PCB space until June. It is not difficult to understand why deals were moving slowly so far in 2026. The conflict in Iran, higher oil prices, and economic uncertainty contributed to the lack of deal flow.

Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

07/20/2026 | Tower Semiconductor
Tower Semiconductor, a leading foundry of high-value analog semiconductor solutions, announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan.

Sikorsky to Integrate MATRIX™ Autonomy into BETA Technologies’ MV250

07/20/2026 | Lockheed Martin
Sikorsky, a Lockheed Martin company, announced that it will integrate its proven MATRIX™ autonomy suite into BETA Technologies’ ALIA MV250 hybrid-vertical‑take‑off‑and‑landing (hVTOL) aircraft.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/17/2026 | Nolan Johnson, SMT007 Magazine
The Pentagon’s announcement on Tuesday that CMMC certification is being immediately suspended is the big news of the week. We’ve been covering the CMMC journey since the beginning, and we’ll stick with the story for the duration. If you’ve followed my list of must-reads, you know that I’m always interested in semiconductor news, and this week had a few good ones. I’ll mention them here, and urge you to read the entire stories: Apple adds to the recent Intel fab agreement by adding to its U.S.-based design and manufacturing agreement with Broadcom; Micron is investing $3 billion to the U.S. semiconductor ecosystem; and Intel announces a 5 billion euro investment in European infrastructure.
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