Dan’s Biz Bookshelf: ‘Innovation X: Why a Company’s Toughest Problems Are Its Greatest Advantage’
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
Fein-Lines: CES 2025—Highlighting the Future With Sony and NVIDIA
SMTA Elects New Board Members
August 7, 2024 | SMTAEstimated reading time: Less than a minute
The SMTA is pleased to announce its election results for the Global Board of Directors for the term beginning October 20, 2024. Greg Vance, Rockwell Automation, has been elected president. Incumbents Jason Keeping, P.Eng., Celestica, Inc.; Adam Klett, Ph.D., KYZEN Corporation; and Kirk Van Dreel, Plexus Corp., were re-elected and will maintain their positions on the board. Mumtaz Bora, pSemi, has been newly elected to the Board of Directors.
Those remaining on the SMTA Global Board of Directors include: VP Membership, Robert Boguski, Datest; Secretary, Tom Rovere, Lockheed Martin; and VP Communications, Mike Konrad, Aqueous Technologies. Strategic Development Committee members include chairperson Ravi Parthasarathy, M.S.Ch.E, ZESTRON Corporation; Priyanka Dobriyal, Ph.D., Intel Corporation; Maurice Dore, Valeo; and Julie Silk, Keysight Technologies.
The SMTA will bid a fond farewell to departing President, Martin Anselm, Ph.D., Rochester Institute of Technology. As his time on the Board draws to a close, the SMTA expresses its sincerest gratitude for his continued service and dedication to the association and industry.
Share on:
Suggested Items
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.
Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.
SparkFun, Digi International Collaborate to Simplify LoRaWAN® IoT Deployment
01/07/2025 | PRNewswireSparkFun Electronics, a leader in open-source embedded electronics, and Digi International ®, a leading global provider of complete end-to-end Internet of Things (IoT) connectivity products, solutions and services, announce the launch of a collaborative new development board, the SparkFun IoT Node for LoRaWAN®, as well as two kits, one each for North America and Europe, the SparkFun Digi X-ON™ Kit for LoRaWAN®
Amar Maletira Appointed to Celestica’s Board of Directors
01/07/2025 | CelesticaCelestica Inc., a leader in design, manufacturing, hardware platform and supply chain solutions for the world’s most innovative companies is pleased to announce the appointment of Amar Maletira to its Board of Directors, effective January 1, 2025.
Zhen Ding’s Subsidiary BoardTek Electronics Experienced a Fire Incident
01/06/2025 | Zhen Ding TechnologyZhen Ding Technology Holding Co., Ltd. announced that its subsidiary, BoardTek Electronics, experienced a fire incident in the copper plating workshop of their second factory (January 5th). BoardTek promptly evacuated all personnel without any injuries.Zhen Ding Technology Holding Co., Ltd. announced that its subsidiary, BoardTek Electronics, experienced a fire incident in the copper plating workshop of their second factory.