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Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation

01/14/2025 | Merlin Circuit Technology
Merlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.

Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore

01/10/2025 | Micron
Micron Technology, Inc. broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.

Focus on electronica: Future Challenges From a Designer’s Viewpoint

01/09/2025 | I-Connect007 Editorial Team
Thomas Romont is CEO of WorldWide Electronic Circuits in Nantes, France, and chair of the IPC Designers Council France. He gave a presentation at electronica titled Challenges for the Future From a PCB/PCBA Designer Perspective. We asked Thomas to share his thoughts about the class, why this topic is so important, and what he hoped attendees would take away from his class.

TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego

01/09/2025 | TopLine
TopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.

NASA’s Kennedy Marks New Chapter for Florida Space Industry

01/09/2025 | NASA
The future of research and technology at NASA’s Kennedy Space Center in Florida is expanding Wednesday, as Kennedy’s center director and charter members in the Florida University Space Research Consortium signed a memorandum of understanding in research and development to assist with missions and contribute to NASA’s Moon to Mars exploration approach.
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