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Total Electronics Assembly Value (OEM+EMS+ODM) Market to Reach $1.5 Trillion by 2028 Driven by EMS Demand
August 9, 2024 | Globe NewswireEstimated reading time: 1 minute
The worldwide electronics manufacturing services (EMS) market is a determining force in the production of electronics products and 2023 accounted for 42 percent of all assembly completed. However, outsourcing grew negatively in 2023 from the previous year as a result of an economic downturn in the computer and communication industries. This resulted in an industry decline of approximately approximately 8.1 percent in 2023. Both EMS and ODMs suffered equally, particularly those serving the top tier.
The Worldwide Electronics Manufacturing Services Market - 2024 Edition is the most comprehensive market research report on the EMS industry. This analysis focuses on the leading players, growing market segments, total available market (TAM), and emerging manufacturing opportunities and technologies by numerous products and countries.
The report begins with an analysis of the worldwide electronics assembly market, giving a baseline for the manufacturing value of electronics product assemblies. A forecast is checked against 46 individual product segments that make up the majority of electronics assembly (automotive, consumer, industrial, medical, aviation and aerospace and defense industries).
Some segments such as transportation and industrial are strong sources for outsourcing demand. The research team estimates that total electronics assembly value (OEM+EMS+ODM) was $1.3 trillion in 2023 and will grow to approximately $1.5 trillion in 2028 at a CAGR of 4.6 percent, mostly fueled by the demand for EMS services.
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Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.