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Total Electronics Assembly Value (OEM+EMS+ODM) Market to Reach $1.5 Trillion by 2028 Driven by EMS Demand
August 9, 2024 | Globe NewswireEstimated reading time: 1 minute
The worldwide electronics manufacturing services (EMS) market is a determining force in the production of electronics products and 2023 accounted for 42 percent of all assembly completed. However, outsourcing grew negatively in 2023 from the previous year as a result of an economic downturn in the computer and communication industries. This resulted in an industry decline of approximately approximately 8.1 percent in 2023. Both EMS and ODMs suffered equally, particularly those serving the top tier.
The Worldwide Electronics Manufacturing Services Market - 2024 Edition is the most comprehensive market research report on the EMS industry. This analysis focuses on the leading players, growing market segments, total available market (TAM), and emerging manufacturing opportunities and technologies by numerous products and countries.
The report begins with an analysis of the worldwide electronics assembly market, giving a baseline for the manufacturing value of electronics product assemblies. A forecast is checked against 46 individual product segments that make up the majority of electronics assembly (automotive, consumer, industrial, medical, aviation and aerospace and defense industries).
Some segments such as transportation and industrial are strong sources for outsourcing demand. The research team estimates that total electronics assembly value (OEM+EMS+ODM) was $1.3 trillion in 2023 and will grow to approximately $1.5 trillion in 2028 at a CAGR of 4.6 percent, mostly fueled by the demand for EMS services.
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Brent Fischthal - Koh YoungSuggested Items
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/29/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
Teledyne FLIR Defense to Deliver Portable Chemical Detectors to US Customs and Border Protection
10/21/2025 | BUSINESS WIRETeledyne FLIR Defense, part of Teledyne Technologies Incorporated, announced that it has received an order from U.S. Customs and Border Protection (CBP) for 15 of its Griffin™ G510x portable chemical detectors, specifically designed to analyze and identify explosives and narcotics, such as fentanyl and nitazenes, within five minutes.
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.