Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Latest Advancements in High-Reliability Electronics Focus of 2024 IPC High Reliability Forum
August 12, 2024 | IPCEstimated reading time: 1 minute
Ensuring reliability in high-voltage electronics, a new standardized test method for abrasion resistance of e-textiles, and assembly and solder joint X-ray challenges are just a few of technical conference topics offered at IPC’s High Reliability Forum, October 9-10 at the McKimmon Center in Raleigh, N.C.
Additional presentation topics cover: safety critical electronics considerations; military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements; and industry-curated content covering many different topics related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods.
Speakers from the following companies include Denis Barbini, Ph.D., Zestron; Steven Dirkes, U.S. Army; Ben Gumpert, Lockheed Martin; Norbert Holle, Ph.D., Robert Bosch GmbH; Takenori Kakutani, Taiyo Ink Manufacturing; Tony Lentz, FCT Assembly; Bob Neves, Microtek Laboratories & Reliability Assessment Solutions; Tim Pearson, Collins Aerospace; Erin Tillery, NC State University; and Udo Welzel, Ph.D., Robert Bosch GmbH.
“The event provides a unique opportunity for those in industry who design, manufacture, or test electronics for critical applications with unique safety, reliability, and lifetime requirements to obtain the latest research on high-reliability electronics,” said Teresa Rowe, IPC senior director, assembly and standards technology. “This year, attendees will learn about the newest research and emerging trends in high-reliability electronics, hear from subject matter experts, connect with exhibitors and peers, and take advantage of several networking opportunities during the course of the two-day forum.”
IPC High Reliability Forum will be co-located with IPC Builds which is being held October 5-10, 2024, at the McKimmon Center. IPC Builds focuses on IPC standards development committee meetings and encourages industry’s contribution to the standards and guidelines that companies and their customers, suppliers, and competitors rely on. Separate registration is required.
For more information on the IPC High Reliability Forum including agenda, speaker profiles, exhibition and sponsorship information, or to register for event, visit www.ipc.org/event/high-reliability-forum.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
The Road to Reliability: Why EV Electronics Matter More Than Ever
09/16/2025 | Stanton Rak, SF Rak CompanyThe global transition to e-Mobility is redefining the design and reliability expectations of automotive electronics. Unlike their internal combustion engine (ICE) counterparts, EVs operate under "always-on" conditions and are subject to higher voltages, higher currents, and elevated thermal loads. These systems also incorporate exponentially more sensors, control units, and advanced power electronics, often tightly packed in thermally constrained spaces.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.