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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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DuPont Acquires Nanowire Technology and Business Assets from C3Nano
August 14, 2024 | DuPontEstimated reading time: Less than a minute
On August 1, DuPont completed the acquisition of assets from C3Nano Inc., a materials company specialized in silver nanowire technology and formulations based in CA, U.S.
This acquisition expands DuPont's electronics materials offerings and adds capabilities to provide cutting-edge technological solutions for transparent and flexible films and inks. This business is now part of DuPont’s offerings in Interconnect Solutions (ICS), a business under DuPont Electronics & Industrial.
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IKT Electronics Chooses TRI's X-ray Technology
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