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Siemens Extends PAVE360 Technology to AMD GPUs Running on Microsoft Azure Cloud

03/11/2025 | Siemens
Siemens Digital Industries Software announced that it has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360™ technology for Software Defined Vehicle (SDV) development which is now available on AMD Radeon™ PRO V710 GPUs and AMD EPYC™ CPUs running on Azure, Microsoft’s cloud and AI platform.

Infineon Launches Automotive-Grade RISC-V Microcontroller Family

03/06/2025 | Infineon
Infineon Technologies AG leads the way for the adoption of RISC-V in the automotive industry: The company will launch a new automotive microcontroller family based on RISC-V within the coming years.

Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications

03/03/2025 | Rogers Corporation
Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.

Ennostar Consolidates Resources to Drive High-Value Optical Semiconductors Applications in 3+1 Key Areas

02/25/2025 | TrendForce
In an effort to optimize its organizational structure and accelerate its optical semiconductors business, Ennostar announced on February 21st, 2025, the merger of its subsidiaries—Epistar and Lextar Electronics—under the unified brand of Ennostar Corporation.

EIPC 2025 Winter Conference, Day 2: A Roadmap to Material Selection

02/20/2025 | Pete Starkey, I-Connect007
The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days of conference proceedings. The keynote session and first-day conference proceedings are reported separately. Here is my review of the second day’s conference proceedings. Delegates dutifully assembled bright and early, well-rested and eager to participate in the second day’s proceedings of the EIPC Winter Conference in Luxembourg.
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