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HBM3e 12-Hi Faces Yield Learning Curve and Customer Validation Challenges; 2025 HBM Supply Outlook Remains Uncertain

09/30/2024 | TrendForce
Concerns over a potential HBM oversupply in 2025 have been growing in the market. TrendForce’s Senior Vice President of Research, Avril Wu, reports that it remains uncertain whether manufacturers will be able to ramp up HBM3e production as planned next year.

Spot Market for Memory Struggles in First Half of 2024; Price Challenges Loom in Second Half

08/30/2024 | TrendForce
TrendForce reports that memory module makers have been aggressively increasing their DRAM inventories since 3Q23, with inventory levels rising to 11–17 weeks by 2Q24.

Memory Industry Revenue Expected to Reach Record High in 2025 Due to Increasing Average Prices and the Rise of HBM and QLC

07/22/2024 | TrendForce
TrendForce’s latest report on the memory industry reveals that DRAM and NAND Flash revenues are expected to see significant increases of 75% and 77%, respectively, in 2024, driven by increased bit demand, an improved supply-demand structure, and the rise of high-value products like HBM.

CSPs to Expand into Edge AI, Driving Average NB DRAM Capacity Growth by at Least 7% in 2025

06/26/2024 | TrendForce
TrendForce has observed that in 2024, major CSPs such as Microsoft, Google, Meta, and AWS will continue to be the primary buyers of high-end AI servers, which are crucial for LLM and AI modeling.

Global Semiconductor Fab Capacity Projected to Expand 6% in 2024 and 7% in 2025

06/18/2024 | SEMI
To keep pace with unremitting growth in demand for chips, the global semiconductor manufacturing industry is expected to increase capacity by 6% in 2024 and post a 7% gain in 2025, reaching a record capacity high of 33.7 million wafers per month (wpm: 8-inch equivalent), SEMI announced today in its latest quarterly World Fab Forecast report.
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